公开(公告)号：US20240368754A1

公开(公告)日：2024-11-07

申请号：US18773309

申请日：2024-07-15

Applicant: Applied Materials, Inc.

Inventor： Peiqi WANG ,  Cheng CHENG ,  Kai WU ,  Insu HA ,  Sang Jin LEE

IPC: C23C16/38 ,  C23C16/04 ,  C23C16/455 ,  C23C16/56

Abstract: A structure of a substrate is provided including a tungsten-containing layer including a nucleation layer and a fill layer. The nucleation layer is disposed along sidewalls of the opening. The nucleation layer includes boron and tungsten. The fill layer is disposed over the nucleation layer within the opening. The tungsten-containing layer includes a resistivity of about 16 μΩ·cm or less. The tungsten-containing layer has a thickness of about 200 Å to about 600 Å. The tungsten-containing layer thickness is half a width of the tungsten-containing layer disposed within the opening between opposing sidewall portions of the opening.