公开(公告)号：US20240194635A1

公开(公告)日：2024-06-13

申请号：US18078416

申请日：2022-12-09

Applicant: Applied Materials, Inc.

Inventor： Niranjan PINGLE ,  Jitendra Ratilal BHIMJIYANI ,  Shreshtha Kumar JAISWAL

IPC: H01L23/00

CPC classification number: H01L24/80 ,  H01L24/08 ,  H01L2224/08245 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80908 ,  H01L2224/80986 ,  H01L2924/37001 ,  H01L2924/3701

Abstract: A method for sequencing a hybrid bonding process by double linking a source of dies and a target. The method may include selecting a source of dies for bonding, selecting a target on which the dies will be bonded, linking the source to the target, linking the target to the source, forming an integrated bonding product sequence that includes a first linked bonding sequence for the source and a second linked bonding sequence for the target, determining bonding process chamber allocations and process timing for the source and the target based on the integrated bonding product sequence, and bonding a die from the source to the target using the integrated bonding product sequence.