公开(公告)号：US20220262653A1

公开(公告)日：2022-08-18

申请号：US17513631

申请日：2021-10-28

Applicant: Applied Materials, Inc.

Inventor： Randy A. HARRIS ,  Coby Scott GROVE ,  Paul Zachary WIRTH ,  Avinash SHANTARAM ,  Alpay YILMAZ ,  Amir NISSAN ,  Jitendra Ratilal BHIMJIYANI ,  Niranjan PINGLE ,  Vincent Dicaprio

IPC: H01L21/67 ,  H01L21/687 ,  H01L23/00

Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.

公开(公告)号：US20240194635A1

公开(公告)日：2024-06-13

申请号：US18078416

申请日：2022-12-09

Applicant: Applied Materials, Inc.

Inventor： Niranjan PINGLE ,  Jitendra Ratilal BHIMJIYANI ,  Shreshtha Kumar JAISWAL

IPC: H01L23/00

CPC classification number: H01L24/80 ,  H01L24/08 ,  H01L2224/08245 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80908 ,  H01L2224/80986 ,  H01L2924/37001 ,  H01L2924/3701

Abstract: A method for sequencing a hybrid bonding process by double linking a source of dies and a target. The method may include selecting a source of dies for bonding, selecting a target on which the dies will be bonded, linking the source to the target, linking the target to the source, forming an integrated bonding product sequence that includes a first linked bonding sequence for the source and a second linked bonding sequence for the target, determining bonding process chamber allocations and process timing for the source and the target based on the integrated bonding product sequence, and bonding a die from the source to the target using the integrated bonding product sequence.

公开(公告)号：US20240194503A1

公开(公告)日：2024-06-13

申请号：US18586209

申请日：2024-02-23

Applicant: Applied Materials, Inc.

Inventor： Randy A. HARRIS ,  Coby Scott GROVE ,  Paul Zachary WIRTH ,  Avinash SHANTARAM ,  Alpay YILMAZ ,  Amir NISSAN ,  Jitendra Ratilal BHIMJIYANI ,  Niranjan PINGLE ,  Vincent DICAPRIO

IPC: H01L21/67 ,  H01L21/687 ,  H01L23/00

CPC classification number: H01L21/6719 ,  H01L21/67121 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67294 ,  H01L21/68707 ,  H01L24/97

Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates, wherein at least one of the plurality of automation modules include a bonder chamber and at least one of the plurality of automation modules include a wet clean chamber.