公开(公告)号：US20250118593A1

公开(公告)日：2025-04-10

申请号：US18904967

申请日：2024-10-02

Applicant: Applied Materials, Inc.

Inventor： Vellaichamy NAGAPPAN ,  Viren KALSEKAR ,  Vinay K. PRABHAKAR ,  Siva CHANDRASEKAR ,  Satish RADHAKRISHNAN ,  Tuan Anh (Mike) NGUYEN ,  Saket RATHI

IPC: H01L21/687 ,  C23C16/455 ,  C23C16/458 ,  C23C16/505

Abstract: Embodiments of the present disclosure relate to a processing chamber. The process chamber includes a lid assembly, a choke plate, a pedestal assembly, a ground plate, and a ground ring. A processing region is defined between the lid assembly and the pedestal assembly. The pedestal assembly includes an isolator plate assembly. The isolator plate assembly includes three or more plates. Each plate includes one or more alignment tabs, one or more protrusions, one or more lift pin holes, a ground plate, and a ground ring. The lid assembly, choke plate, and pedestal assembly form a RF return path. The ground plate, includes a cylindrical core, an annular body, and an annular projection. The ground ring includes an annular body, an annular wall, an annular connector, and an annular tab. The ground ring and the ground plate are electrically connected via a RF strap.