Etch improvement
    1.
    发明授权

    公开(公告)号:US11852853B2

    公开(公告)日:2023-12-26

    申请号:US17147338

    申请日:2021-01-12

    CPC classification number: G02B5/1857 H01J37/3056

    Abstract: A method is provided. The method includes exposing a first material disposed across a first plane on a first substrate to an ion beam to form a first plurality of structures in the first material, the ion beam directed at the first material at an ion beam angle ϑ relative to a surface normal of the first substrate. The first substrate is positioned at a first rotation angle ϕ1 between the ion beam and a first vector of the first plurality of structures, the first material is exposed to the ion beam incrementally along a first direction, and exposure of the first material to the ion beam is varied along the first direction to generate a depth variation between the first plurality of structures in the first direction.

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