公开(公告)号：US09498866B2

公开(公告)日：2016-11-22

申请号：US14198560

申请日：2014-03-05

Applicant: Applied Materials, Inc.

Inventor： Christopher Heung-Gyun Lee ,  Thomas Ho Fai Li ,  Tianyu Yang

IPC: B24B53/017 ,  B24B53/00

CPC classification number: B24B53/017 ,  B24B53/003

Abstract: In one embodiment, a method for cleaning a surface of a polishing pad includes conditioning the polishing pad surface and rotating the conditioned polishing pad surface. The method also includes spraying the polishing pad surface to lift debris from the conditioned polishing pad surface. The method further includes vacuuming the debris from the polishing pad surface downstream from where the condition occurs, wherein downstream is defined by a rotational direction of the polishing pad. In another embodiment, a processing station including a rotatable platen, a substrate carrier head, a polishing fluid delivery system, a conditioner, a spray nozzle, and a vacuum system is provided. The conditioner is disposed between the substrate carrier head and the spray nozzle. The vacuum system is configured to vacuum the polishing pad surface. The vacuum system is downstream from the conditioner, defined by a rotation of the platen.

Abstract translation: 在一个实施例中，用于清洁抛光垫表面的方法包括调整抛光垫表面并旋转经调节的抛光垫表面。 该方法还包括喷涂抛光垫表面以从调理的抛光垫表面提起碎屑。 该方法还包括从发生状况的下游的抛光垫表面抽吸碎屑，其中下游由抛光垫的旋转方向限定。 在另一个实施例中，提供了包括可旋转压板，基板载体头，抛光流体输送系统，调节器，喷嘴和真空系统的处理站。 调理剂设置在基板载体头部和喷嘴之间。 真空系统被配置成对抛光垫表面进行真空。 真空系统在调节器的下游，由压盘的旋转限定。