公开(公告)号：US11162168B2

公开(公告)日：2021-11-02

申请号：US16512699

申请日：2019-07-16

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Travis Tesch

IPC: C23C14/54 ,  C23C14/56 ,  G01B11/30

Abstract: Described herein are apparatus and methods used to process a substrate in a chamber, in particular to position a non-round substrate in a holding chamber or a processing chamber. Further described herein are a 3D mapping device that is configured to measure the surface profile of a non-round substrate and a position of the substrate on the robot arm.

公开(公告)号：US11036125B2

公开(公告)日：2021-06-15

申请号：US16512705

申请日：2019-07-16

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Travis Tesch

IPC: G03F1/22 ,  H01L21/67 ,  H01L21/673 ,  G03F7/20 ,  H01L21/68 ,  G03F9/00

Abstract: Described herein are apparatus and methods used to process a substrate in a chamber, in particular to position a non-round substrate in a holding chamber or a processing chamber. Further described herein are methods and apparatus that detect radiation transmitted along the thickness of the substrate between the top surface and the bottom surface, determine a signal strength as the substrate is rotated and obtaining a signal strength pattern to determine a position of the substrate within the chamber with respect to a center position.

公开(公告)号：US20200024726A1

公开(公告)日：2020-01-23

申请号：US16512699

申请日：2019-07-16

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Travis Tesch

IPC: C23C14/54 ,  C23C14/56 ,  G01B11/30

Abstract: Described herein are apparatus and methods used to process a substrate in a chamber, in particular to position a non-round substrate in a holding chamber or a processing chamber. Further described herein are a 3D mapping device that is configured to measure the surface profile of a non-round substrate and a position of the substrate on the robot arm.

公开(公告)号：US20200026177A1

公开(公告)日：2020-01-23

申请号：US16512705

申请日：2019-07-16

Applicant: Applied Materials, Inc.

Inventor： Ala Moradian ,  Travis Tesch

IPC: G03F1/22 ,  H01L21/67 ,  H01L21/673 ,  H01L21/68 ,  G03F7/20

Abstract: Described herein are apparatus and methods used to process a substrate in a chamber, in particular to position a non-round substrate in a holding chamber or a processing chamber. Further described herein are methods and apparatus that detect radiation transmitted along the thickness of the substrate between the top surface and the bottom surface, determine a signal strength as the substrate is rotated and obtaining a signal strength pattern to determine a position of the substrate within the chamber with respect to a center position.