公开(公告)号：US20190235389A1

公开(公告)日：2019-08-01

申请号：US16217024

申请日：2018-12-11

Applicant: Applied Materials, Inc.

Inventor： Chien-Hua Lai ,  Ching-Chang Chen ,  Shih-Hao Kuo ,  Tsu-Hui Yang ,  Hsiu-Jen Wang ,  Yi-Sheng Liu ,  Chia-Hung Kao

IPC: G03F7/20

Abstract: Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.

公开(公告)号：US10928743B2

公开(公告)日：2021-02-23

申请号：US16358323

申请日：2019-03-19

Applicant: Applied Materials, Inc.

Inventor： Chien-Hua Lai ,  Chia-Hung Kao ,  Hsiu-Jen Wang ,  Shih-Hao Kuo ,  Yi-Sheng Liu ,  Shih-Hsien Lee ,  Ching-Chang Chen ,  Tsu-Hui Yang

IPC: G03F7/20 ,  G03F9/00

Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.

公开(公告)号：US10459341B2

公开(公告)日：2019-10-29

申请号：US16217024

申请日：2018-12-11

Applicant: Applied Materials, Inc.

Inventor： Chien-Hua Lai ,  Ching-Chang Chen ,  Shih-Hao Kuo ,  Tsu-Hui Yang ,  Hsiu-Jen Wang ,  Yi-Sheng Liu ,  Chia-Hung Kao

IPC: G03F7/20

Abstract: Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.