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公开(公告)号：US10948834B2
公开(公告)日：2021-03-16
申请号：US16917278
申请日：2020-06-30
Applicant: Applied Materials, Inc.
Inventor： Ching-Chang Chen , Chien-Hua Lai , Wei-Chung Chen , Shih-Hao Kuo , Hsiu-Jen Wang
Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.
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公开(公告)号：US10719018B2
公开(公告)日：2020-07-21
申请号：US16031675
申请日：2018-07-10
Applicant: Applied Materials, Inc.
Inventor： Ching-Chang Chen , Chien-Hua Lai , Wei-Chung Chen , Shih-Hao Kuo , Hsiu-Jen Wang
Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.
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公开(公告)号：US10928743B2
公开(公告)日：2021-02-23
申请号：US16358323
申请日：2019-03-19
Applicant: Applied Materials, Inc.
Inventor： Chien-Hua Lai , Chia-Hung Kao , Hsiu-Jen Wang , Shih-Hao Kuo , Yi-Sheng Liu , Shih-Hsien Lee , Ching-Chang Chen , Tsu-Hui Yang
Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.
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公开(公告)号：US10459341B2
公开(公告)日：2019-10-29
申请号：US16217024
申请日：2018-12-11
Applicant: Applied Materials, Inc.
Inventor： Chien-Hua Lai , Ching-Chang Chen , Shih-Hao Kuo , Tsu-Hui Yang , Hsiu-Jen Wang , Yi-Sheng Liu , Chia-Hung Kao
IPC: G03F7/20
Abstract: Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.
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Patent Agency Ranking
公开(公告)号：US20240027896A1
公开(公告)日：2024-01-25
申请号：US17872546
申请日：2022-07-25
Applicant: Applied Materials, Inc.
Inventor： Shih-Hao Kuo , Hsiu-Jen Wang , Ulrich Mueller , Jang Fung Chen
CPC classification number: G03F7/0002 , G03F7/20 , G03F7/70358 , G03F7/70975
Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.
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公开(公告)号：US20190235389A1
公开(公告)日：2019-08-01
申请号：US16217024
申请日：2018-12-11
Applicant: Applied Materials, Inc.
Inventor： Chien-Hua Lai , Ching-Chang Chen , Shih-Hao Kuo , Tsu-Hui Yang , Hsiu-Jen Wang , Yi-Sheng Liu , Chia-Hung Kao
IPC: G03F7/20
Abstract: Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.
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公开(公告)号：US20250076753A1
公开(公告)日：2025-03-06
申请号：US18765710
申请日：2024-07-08
Applicant: Applied Materials, Inc.
Inventor： Shih-Hao Kuo , Hsiu-Jen Wang , Ulrich Mueller , Jang Fung Chen
Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.
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公开(公告)号：US12032284B2
公开(公告)日：2024-07-09
申请号：US17872546
申请日：2022-07-25
Applicant: Applied Materials, Inc.
Inventor： Shih-Hao Kuo , Hsiu-Jen Wang , Ulrich Mueller , Jang Fung Chen
CPC classification number: G03F7/0002 , G03F7/20 , G03F7/70358 , G03F7/70975
Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.
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公开(公告)号：US20230288822A1
公开(公告)日：2023-09-14
申请号：US17693356
申请日：2022-03-12
Applicant: Applied Materials, Inc.
Inventor： Ulrich Mueller , Hsiu-Jen Wang , Shih-Hao Kuo , Jang Fung Chen
CPC classification number: G03F9/7015 , G01B11/272 , G03F7/70441
Abstract: Actual physical locations of dies on a substrate package may be identified without using a full metrology scan of the substrate. Instead, one or more cameras may be used to efficiently locate the approximate location of any of the alignment features based on their expected positioning in the design file for the packages are substrate. The cameras may then be moved to locations where alignment features should be, and images may be captured to determine the actual location of the alignment feature. These actual locations of the alignment features may then be used to identify coordinates for the dies, as well as rotations and/or varying heights of the dies on the packages. A difference between the expected location from the design file and the actual physical location may be used to adjust instructions for the digital lithography system to compensate for the misalignment of the dies.
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