公开(公告)号：US12288704B2

公开(公告)日：2025-04-29

申请号：US17989980

申请日：2022-11-18

Applicant: Applied Materials, Inc.

Inventor： Ralph P. Antonio ,  Lee Guan Tay ,  Peter Lai ,  Sudhir R. Gondhalekar ,  Tzu-Fang Huang ,  Jeffrey Hudgens

IPC: H01L21/67 ,  B25J9/16 ,  B25J11/00 ,  B25J13/08 ,  B25J19/02 ,  G01S17/89 ,  H01L21/677

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, an apparatus for processing a substrate comprises a transfer robot configured to position a substrate on a substrate support disposed within an interior of a processing chamber configured to process the substrate and a sensor disposed on the transfer robot, operably connected to a controller of the processing chamber, and configured with an angle of view to provide in-situ continuous closed loop feedback relating to spatial information of the interior of the processing chamber to the controller.