公开(公告)号：US20180358212A1

公开(公告)日：2018-12-13

申请号：US15771803

申请日：2015-12-09

Applicant: Applied Materials, Inc.

Inventor： Thomas Werner ZILBAUER ,  Uwe HENKEL ,  Johannes THIEL ,  Kamal EL ZAAR ,  Stefan KELLER

IPC: H01J37/34

CPC classification number: H01J37/3441 ,  C23C14/3471 ,  H01J37/32477 ,  H01J37/32605 ,  H01J37/32651

Abstract: The present disclosure provides a system configured for sputter deposition on a substrate. The system includes a sputter deposition chamber having a processing zone, one or more sputter deposition sources arranged at a first side of the processing zone, and a shielding device arranged at a second side of the processing zone, wherein the shielding device includes a frame assembly mounted to the sputter deposition chamber and one or more conductive sheets detachably mounted on the frame assembly, wherein the one or more conductive sheets provide a surface arranged along the processing zone.