Polishing head with local wafer pressure

    公开(公告)号:US11986923B2

    公开(公告)日:2024-05-21

    申请号:US17512284

    申请日:2021-10-27

    CPC classification number: B24B37/32 B24B37/005 B24B37/04

    Abstract: A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad.

    Polishing head with local wafer pressure

    公开(公告)号:US12251788B2

    公开(公告)日:2025-03-18

    申请号:US18630886

    申请日:2024-04-09

    Abstract: A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad.

    POLISHING CARRIER HEAD WITH MULTIPLE ZONES
    3.
    发明公开

    公开(公告)号:US20230405758A1

    公开(公告)日:2023-12-21

    申请号:US18461274

    申请日:2023-09-05

    CPC classification number: B24B37/30 B24B37/105 B24B37/005 B24B37/32

    Abstract: A carrier head for a polishing system includes a housing, a flexible membrane, a first plurality of pressure supply lines, a second plurality of pressure supply lines, and a valve assembly. The flexible membrane defines a multiplicity of independently pressurizable chambers. The valve assembly has a multiplicity of valves with each respective valve of the multiplicity of valves coupled to a respective pressure chamber from the multiplicity of independently pressurizable chambers. Each respective valve is configured to selectively couple the respective pressure chamber to one pressure supply line from a pair of pressure supply lines that include a pressure supply line from the first plurality of pressure supply lines and a pressure supply line from the second plurality of pressure supply lines.

    Polishing carrier head with multiple angular pressurizable zones

    公开(公告)号:US11780049B2

    公开(公告)日:2023-10-10

    申请号:US17359410

    申请日:2021-06-25

    CPC classification number: B24B37/30 B24B37/005 B24B37/105 B24B37/32

    Abstract: A carrier head for a polishing system includes a housing, a flexible membrane, a first plurality of pressure supply lines, a second plurality of pressure supply lines, and a valve assembly. The flexible membrane defines a multiplicity of independently pressurizable chambers. The valve assembly has a multiplicity of valves with each respective valve of the multiplicity of valves coupled to a respective pressure chamber from the multiplicity of independently pressurizable chambers. Each respective valve is configured to selectively couple the respective pressure chamber to one pressure supply line from a pair of pressure supply lines that include a pressure supply line from the first plurality of pressure supply lines and a pressure supply line from the second plurality of pressure supply lines.

    POLISHING CARRIER HEAD WITH MULTIPLE ANGULAR PRESSURIZABLE ZONES

    公开(公告)号:US20210402558A1

    公开(公告)日:2021-12-30

    申请号:US17359410

    申请日:2021-06-25

    Abstract: A carrier head for a polishing system includes a housing, a flexible membrane, a first plurality of pressure supply lines, a second plurality of pressure supply lines, and a valve assembly. The flexible membrane defines a multiplicity of independently pressurizable chambers. The valve assembly has a multiplicity of valves with each respective valve of the multiplicity of valves coupled to a respective pressure chamber from the multiplicity of independently pressurizable chambers. Each respective valve is configured to selectively couple the respective pressure chamber to one pressure supply line from a pair of pressure supply lines that include a pressure supply line from the first plurality of pressure supply lines and a pressure supply line from the second plurality of pressure supply lines.

    POLISHING CARRIER HEAD WITH MULTIPLE ANGULAR PRESSURIZABLE ZONES

    公开(公告)号:US20210402549A1

    公开(公告)日:2021-12-30

    申请号:US17359419

    申请日:2021-06-25

    Abstract: A carrier head for a polishing system includes a housing, a flexible membrane, a first plurality of pressure supply lines, a second plurality of pressure supply lines, and a valve assembly. The flexible membrane defines a multiplicity of independently pressurizable chambers. The valve assembly has a multiplicity of valves with each respective valve of the multiplicity of valves coupled to a respective pressure chamber from the multiplicity of independently pressurizable chambers. Each respective valve is configured to selectively couple the respective pressure chamber to one pressure supply line from a pair of pressure supply lines that include a pressure supply line from the first plurality of pressure supply lines and a pressure supply line from the second plurality of pressure supply lines.

Patent Agency Ranking