公开(公告)号：US20240307963A1

公开(公告)日：2024-09-19

申请号：US18183000

申请日：2023-03-13

Applicant: Applied Materials, Inc.

Inventor： Ximeng XUE ,  David J. LISCHKA ,  Jay GURUSAMY ,  Steven M. ZUNIGA ,  Jeonghoon OH ,  Jagan RANGARAJAN

IPC: B22F10/28 ,  B22F10/66 ,  B29C64/153 ,  B29C64/30 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y70/10 ,  B33Y80/00

CPC classification number: B22F10/28 ,  B22F10/66 ,  B29C64/153 ,  B29C64/30 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y70/10 ,  B33Y80/00

Abstract: Embodiments of the disclosure provided herein include an apparatus and method for additive manufacturing a component for a semiconductor processing apparatus. The apparatus for additive manufacturing includes a printhead configured to selectively deposit layers on build the component, wherein the printhead may selectively deposit a first set of layers onto the build platform, and selectively deposit a second set of layers on the first set of layers, each of the second set of layers comprising a gap that forms a cooling channel through the component. The cooling channel is filled a filler material. A third set of layers covers the cooling channel before the channel is exposed to a liquidizing agent, wherein the liquidizing agent reacts with the filler material to produce an effluent fluid which is then drained. In other embodiments, the cooling channel may be machined into the component before being filled with the filler material.