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公开(公告)号：US20220111484A1
公开(公告)日：2022-04-14
申请号：US17501687
申请日：2021-10-14
Applicant: Applied Materials, Inc.
Inventor： Andrew NAGENGAST , Steven M. ZUNIGA , Jay GURUSAMY
IPC: B24B37/32 , B24B37/005 , H01L21/306
Abstract: Embodiments herein generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of electronic devices. In one embodiment, a substrate carrier for polishing a surface of a substrate includes a retaining ring configured to surround a substrate during a polishing process. The retaining ring includes a first surface that is configured to contact a surface of a polishing pad during the polishing process, a second surface that is on a side of the retaining ring that is opposite to the first surface, and an array of recesses formed in the second surface. The substrate carrier for polishing a surface of a substrate also includes a plurality of load bearing pins where each load bearing pin of the plurality of load bearing pins includes a contact surface and a body that has a length, and at least a portion of the length of each load bearing pin of the plurality of load bearing pins is disposed within each recess of the array of recesses and the contact surface of each load bearing pin of the plurality of load bearing pins is positionable relative to a surface of the recess in which it is disposed during the polishing process.
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公开(公告)号：US20210323117A1
公开(公告)日：2021-10-21
申请号：US16851012
申请日：2020-04-16
Applicant: Applied Materials, Inc.
Inventor： Jagan RANGARAJAN , Edward GOLUBOVSKY , Jay GURUSAMY , Steven M. ZUNIGA
IPC: B24B37/34 , B24B37/30 , B24B37/04 , H01L21/306 , H01L21/67 , H01L21/677
Abstract: Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loading station, and a polishing station. The carrier support module features a carrier platform and one or more carrier assemblies. The one or more carrier assemblies each comprise a corresponding carrier head suspended from the carrier platform. The carrier loading station is used to transfer substrates to and from the carrier heads. The polishing station comprises a polishing platen. The carrier support module, the substrate loading station, and the polishing station comprise a one-to-one-to-one relationship within each of the polishing modules. The carrier support module is positioned to move the one or more carrier assemblies between a substrate polishing position disposed above the polishing platen and a substrate transfer position disposed above the substrate loading station.
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公开(公告)号：US20220111483A1
公开(公告)日：2022-04-14
申请号：US17087941
申请日：2020-11-03
Applicant: Applied Materials, Inc.
Inventor： Andrew NAGENGAST , Steven M. ZUNIGA , Jay GURUSAMY
Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of semiconductor devices. In one embodiment, the apparatus includes a polishing module, a retaining ring, wherein the retaining ring includes a protrusion on a radially outward edge, and a plurality of load pins disposed through the retaining ring.
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公开(公告)号：US20210323118A1
公开(公告)日：2021-10-21
申请号：US16871588
申请日：2020-05-11
Applicant: Applied Materials, Inc.
Inventor： Jagan RANGARAJAN , Edward GOLUBOVSKY , Jay GURUSAMY , Steven M. ZUNIGA
IPC: B24B37/34 , B24B37/04 , H01L21/67 , H01L21/677 , H01L21/306 , B24B37/30
Abstract: Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loading station, and a polishing station. The carrier support module features a carrier platform and one or more carrier assemblies. The one or more carrier assemblies each comprise a corresponding carrier head suspended from the carrier platform. The carrier loading station is used to transfer substrates to and from the carrier heads. The polishing station comprises a polishing platen. The carrier support module, the substrate loading station, and the polishing station comprise a one-to-one-to-one relationship within each of the polishing modules. The carrier support module is positioned to move the one or more carrier assemblies between a substrate polishing position disposed above the polishing platen and a substrate transfer position disposed above the substrate loading station.
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公开(公告)号：US20200086456A1
公开(公告)日：2020-03-19
申请号：US16552901
申请日：2019-08-27
Applicant: Applied Materials, Inc.
Inventor： Dmitry SKLYAR , Jeonghoon OH , Gerald J. ALONZO , Jonathan DOMIN , Steven M. ZUNIGA , Jay GURUSAMY
IPC: B24B49/04 , H01L21/321 , H01L21/67 , B24B37/005 , B24B57/04
Abstract: Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20190030677A1
公开(公告)日：2019-01-31
申请号：US16037783
申请日：2018-07-17
Applicant: Applied Materials, Inc.
Inventor： Jeonghoon OH , David J. LISCHKA , Erik RONDUM , Jay GURUSAMY , Robert D. TOLLES , Steven M. ZUNIGA , Steven M. REEDY , Wai- Ming KAN
IPC: B24B37/24 , B24B37/005
Abstract: Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In one implementation, a method of polishing a substrate is provided. The method comprises advancing a polishing material across a surface of a platen. The polishing material has a polishing surface and an opposing backside surface and the backside surface has a pattern of identifying features formed thereon. The method further comprises sensing the movement of the pattern of identifying features past a detector assembly. The method further comprises controlling a position of the polishing material relative to the platen based on data received from the sensed movement of the pattern of identifying features.
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公开(公告)号：US20240391056A1
公开(公告)日：2024-11-28
申请号：US18322928
申请日：2023-05-24
Applicant: Applied Materials, Inc.
Inventor： Nai-Chieh HUANG , Jianshe TANG , Shih-Haur SHEN , Akshay ARAVINDAN , Chih-Han YANG , Jay GURUSAMY , Jeonghoon OH , Steven M. ZUNIGA
IPC: B24B53/017
Abstract: Embodiments of the disclosure provided for a pad conditioner with multiple disks for chemical mechanical polishing. The pad conditioner includes a bearing ring connected to a lower portion of a shaft, an outer disk assembly connected to the lower portion of the shaft, the outer disk assembly, an outer disk flexure, a plurality of outer disks disposed on a bottom surface of the outer disk, and an inner disk assembly. Alternatively, the outer disk assembly includes a plurality of outer disk holders, an outer disk connector connecting the plurality of outer disk holders, and a plurality of outer disks disposed on a bottom surface of the outer disk holders. The inner disk assembly includes a flexure connected to the outer disk assembly, the inner disk assembly, and the shaft. The pad conditioner may include a spherical bearing assembly coupled to a lower portion of the shaft.
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公开(公告)号：US20220143779A1
公开(公告)日：2022-05-12
申请号：US17512284
申请日：2021-10-27
Applicant: Applied Materials, Inc.
Inventor： Andrew NAGENGAST , Steven M. ZUNIGA , Jay GURUSAMY , Charles C. GARRETSON , Vladmir GALBURT
IPC: B24B37/32 , B24B37/04 , B24B37/005
Abstract: A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply a pressure between a substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring thereby altering the pressure applied between the substrate and the polishing pad.
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公开(公告)号：US20200376700A1
公开(公告)日：2020-12-03
申请号：US16884888
申请日：2020-05-27
Applicant: Applied Materials, Inc.
Inventor： Bum Jick KIM , Danielle LOI , Jay GURUSAMY , Steven M. ZUNIGA
Abstract: Embodiments of the present disclosure generally relate to methods of manufacturing polishing platens for use on a chemical mechanical polishing (CMP) system and polishing platens formed therefrom. A method of manufacturing a polishing includes positioning a polishing platen on a support of a manufacturing system. The manufacturing system includes the support and a cutting tool facing there towards. Here, the polishing platen includes a cylindrical metal body having a polymer layer disposed on a surface thereof and the polymer layer has a thickness of about 100 μm or more. The method further includes removing at least a portion of the polymer layer using the cutting tool to form a polishing pad-mounting surface. Beneficially, the method may be used to form a pad-mounting surface having a desired flatness or shape, such as a concave or convex shape.
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公开(公告)号：US20180207770A1
公开(公告)日：2018-07-26
申请号：US15875867
申请日：2018-01-19
Applicant: Applied Materials, Inc.
Inventor： Robert D. TOLLES , Gregory E. MENK , Eric DAVEY , You WANG , Huyen Karen TRAN , Fred C. REDEKER , Veera Raghava Reddy KAKIREDDY , Ekaterina MIKHAYLICHENKO , Jay GURUSAMY
Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.
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