公开(公告)号：US20240227120A1

公开(公告)日：2024-07-11

申请号：US18204774

申请日：2023-06-01

Applicant: Applied Materials, Inc.

Inventor： Sudhakar MADHUSOODHANAN ,  Xinyi LU ,  Srikant PATHAK

IPC: B24B37/24 ,  B24B37/22 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C08F20/06 ,  C08F20/36

CPC classification number: B24B37/24 ,  B24B37/22 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C08F20/06 ,  C08F20/36 ,  B29K2033/00

Abstract: The disclosure generally relates to polishing pads, methods of manufacturing polishing pads, and formulations for manufacturing polishing pads, and more particularly, to polishing pads used for chemical mechanical polishing (CMP) of a substrate in electronic device processing. In one aspect, a photocurable printing composition containing photopolymerizable compounds and photopolymerization initiator is provided. The photocurable printing composition comprises a urethane acrylate oligomer having a functionality of 2 or more, a nominal viscosity greater than 20,000 cP at 60 degrees Celsius, and a glass transition temperature (Tg) of −4 degrees Celsius or greater, the urethane acrylate oligomer present from about 20% to about 60% by weight based on a total weight of the photopolymerizable compounds. The photocurable printing composition has a viscosity of 20 centipoise or higher at 70 degrees Celsius.

公开(公告)号：US20250034296A1

公开(公告)日：2025-01-30

申请号：US18226962

申请日：2023-07-27

Applicant: Applied Materials, Inc.

Inventor： Xinyi LU ,  Srikant PATHAK ,  Sudhakar MADHUSOODHANAN

IPC: C08F20/56 ,  B24B37/22 ,  B24B37/24 ,  C08L39/06

Abstract: Polishing pads having porogen-features, methods of manufacturing polishing pads having porogen features, and compositions for manufacturing polishing pads having porogen features, and more particularly, to polishing pads used for chemical mechanical polishing (CMP) of a substrate in electronic device processing are provided. In one aspect, the porogen-forming composition, in proportions based on a total weight of the porogen-forming composition, includes (A) from about 60 to about 80 wt. % of an acrylamide monomer compound selected from acryloylmorpholine, N, N-dimethylacrylamide, or a combination thereof. The curable porogen-forming composition further includes (B) from about 10 to about 40 wt. % of a polyhydroxy compound having two or more hydroxyl groups. The curable porogen-forming composition further includes (C) from about 0.2 wt. % to about 4 wt. % of a photoinitiator component.