公开(公告)号：US20250054737A1

公开(公告)日：2025-02-13

申请号：US18231655

申请日：2023-08-08

Applicant: Applied Materials, Inc.

Inventor： Karthik ELUMALAI ,  Ananthkrishna JUPUDI ,  Arunkumar TATTI ,  Cheng SUN ,  Ye LIU

IPC: H01J37/32

Abstract: Embodiments of substrate supports having electrostatic chucks (ESCs) for use in substrate process chambers are provided herein. In some embodiments, a substrate support includes: an electrostatic chuck (ESC) having a top surface and a plurality of mesas extending upward from the top surface, wherein an upper surface of the plurality of mesas define a substrate support surface, wherein a total surface area of the substrate support surface is about 18 to about 40 percent a total surface area of the upper surface, and wherein the ESC includes a plurality of backside gas openings extending through the ESC; and one or more chucking electrodes disposed in the ESC.