DIGITAL SIMULATION FOR SEMICONDUCTOR MANUFACTURING PROCESSES

    公开(公告)号:US20240329626A1

    公开(公告)日:2024-10-03

    申请号:US18191710

    申请日:2023-03-28

    CPC classification number: G05B19/41885 G05B2219/45032

    Abstract: The disclosure describes methods and systems for operating a manufacturing process with a concurrent real-time simulation of the manufacturing process via a digital twin model. Sensor data indicative of parameters of an ongoing manufacturing process are input into the digital twin model, and used to predict an output of the manufacturing process. The predicted output is compared to a target output. One or more trained machine learning models are used to determine a corrective action to be implemented by a controller of the manufacturing process to minimize any deviation from the target output.

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