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公开(公告)号:US11057112B1
公开(公告)日:2021-07-06
申请号:US16737414
申请日:2020-01-08
Applicant: Applied Optoelectronics, Inc.
Inventor: Kai-Sheng Lin , Hao-Chiang Cheng , Hang Xie
Abstract: The present disclosure is generally directed to a monitor photodiode (MPD) submount for use in optical transceivers that includes a body with a conductive trace pattern disposed on multiple surfaces of the same to allow for vertical mounting of an associated MPD and simplified electrical interconnection with TOSA circuitry without the necessity of electrical interconnection. The MPD submount includes a body defined by a plurality of sidewalls. At least one surface of the body provides a mounting surface for coupling to and supporting an MPD. The MPD submount further includes a conductive trace pattern that provides at least one conductive path that is disposed on the mounting surface and on at least one adjoining sidewall. The portion of the at least one conductive path disposed on the adjoining sidewall extends substantially transverse relative to the surface defining the transceiver/transmitter substrate when the MPD submount is coupled to the same.
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公开(公告)号:US11177887B2
公开(公告)日:2021-11-16
申请号:US16737438
申请日:2020-01-08
Applicant: Applied Optoelectronics, Inc.
Inventor: Kai-Sheng Lin , Hang Xie , Yi Wang
Abstract: The present disclosure is generally directed to a stepped profile for substrates that support “on board” optical subassembly arrangements. The stepped profile enables mounting TOSA modules to the substrate in a recessed orientation to reduce the overall distance between terminals of the substrate and associated components of the TOSA, e.g., RF terminals of the substrate and an LDD of the TOSA. In an embodiment, the stepped profile further simplifies mounting and optical alignment of TOSA modules by providing at least one mechanical stop to engage surfaces of the TOSA modules and limit travel by the same along one or more axis.
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公开(公告)号:US11289875B2
公开(公告)日:2022-03-29
申请号:US16693365
申请日:2019-11-24
Applicant: Applied Optoelectronics, Inc.
Inventor: Kai-Sheng Lin , Hang Xie , Ming Qi
IPC: H01S5/0233 , H01S5/02212 , H04B10/40 , H01S5/024 , H01S5/023 , H01S5/0235 , F21V8/00
Abstract: In general, a temperature control device for use in laser assemblies and optical subassemblies is disclosed that includes at least two electrically conductive terminals to enable flexible electrical coupling to associated components, e.g., monitor photodiodes and laser diodes, and accommodate a range of laser assembly configurations without the necessity of supplying a negative voltage rail. In more detail, a temperature control device consistent with the present disclosure includes a bottom plate, a top plate, and a plurality of semiconductor elements disposed therebetween. The top plate includes a component mounting surface that provides at least a first and second electrically conductive terminal/pad. The first and second electrically conductive terminals/pads can be electrically isolated, e.g., via a gap, and configured to provide first and second voltage potentials respectively.
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