公开(公告)号：US20230187101A1

公开(公告)日：2023-06-15

申请号：US18071159

申请日：2022-11-29

Applicant: Aptiv Technologies Limited

Inventor： David R. Peterson ,  Joseph Sudik, JR. ,  Jesse Braun ,  David Siegfried

IPC: H01B7/04 ,  H01B7/08 ,  H01B7/18 ,  H01B13/32

CPC classification number: H01B7/04 ,  H01B7/0846 ,  H01B7/1805 ,  H01B13/322

Abstract: A method of forming a flexible circuit, including providing a flexible flat cable with a first surface and a second surface. The first surface of the flexible flat cable is diametrically opposed to the second surface. A dispensing apparatus including a nozzle is further provided, and an extruded material is dispensed through the nozzle onto the first surface of the flexible flat cable. The extruded material is shaped into a pattern and cured onto the first surface of the flexible flat cable.

公开(公告)号：US20230178264A1

公开(公告)日：2023-06-08

申请号：US18071183

申请日：2022-11-29

Applicant: Aptiv Technologies Limited

Inventor： David R. Peterson ,  Joseph Sudik, JR. ,  Jesse Braun ,  David Siegfried

IPC: H01B7/08 ,  H01B19/02 ,  H01B19/04

CPC classification number: H01B7/0823 ,  H01B19/02 ,  H01B19/04

Abstract: A wiring assembly including a flex circuit including a plastic laminate layer and a mount location configured to receive a fastener secured to a substrate. The wiring assembly further includes a flex circuit attachment feature, the flex circuit attachment feature including an extruded material bonded to the plastic laminate layer at the mount location. The flex circuit attachment feature provides a structural strength at the mount location and provides a cushion between the flex circuit and the substrate.