公开(公告)号：US20220326469A1

公开(公告)日：2022-10-13

申请号：US17658424

申请日：2022-04-07

Applicant: Aptiv Technologies Limited

Inventor： Przemyslaw Antos ,  Janusz Duralek ,  Udo Soehngen

IPC: G02B7/02 ,  G02B27/62 ,  B29D11/00

Abstract: Method of assembling an optical device in which a circuit board is provided supporting an imager, and a support is provided for supporting the circuit board. A first adhesive layer is applied to a mating region of at least one of the circuit board and the support. The circuit board is fixed to the support using at least one fastener. The first adhesive layer is compressed between the mating regions once the circuit board is fastened. The first adhesive layer is then cured for forming a stabilised imager assembly. A lens is then fixed to the stabilised imager assembly using a second adhesive layer, where fixing includes positioning the lens on the support to align its focal plane with the imager and then curing the second adhesive layer.

公开(公告)号：US11864365B2

公开(公告)日：2024-01-02

申请号：US17951297

申请日：2022-09-23

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Janusz Duralek ,  Krzysztof Adamczyk

IPC: H05K9/00

CPC classification number: H05K9/0015

Abstract: An electromagnetic compatibility (EMC) housing having a first part and a second part for forming an enclosure when fitted together. The first and second parts include first and second interface surfaces respectively, for compressing a gasket interposed between the interface surfaces when the first and second parts are fitted together. At least one of the first and second interface surfaces includes a plurality of undercut regions for reducing compression of the gasket in the region when the first and second parts are fitted together.