公开(公告)号：US06325709B1

公开(公告)日：2001-12-04

申请号：US09442495

申请日：1999-11-18

申请人： Arun Kumar Nanda ,  Ser Wee Quek

发明人： Arun Kumar Nanda ,  Ser Wee Quek

IPC分类号： B24B2118

CPC分类号： B24B53/017 ,  B24B53/12 ,  B24D3/06 ,  B24D7/02 ,  B24D18/0018

摘要： A polishing pad conditioner used in the removal of slurry and semiconductor thin film build-up in the polishing pad in a chemical and mechanical polishing (CMP) process used to planarize a semiconductor wafer surface. The conditioner is pressed against the polishing pad, often while de-ionized water is applied, to remove the material build-up. The conditioner of the present invention has a convex lower surface covered by diamond crystals that are bonded to the underside of the nickel alloy conditioner. Typically, the difference between the center and the edge of the conditioning surface will range from a minimum of about 0.2 mm (very slightly convex) to a maximum of the entire thickness of the conditioning surface (more convex). The convex shape reduces the friction between the pad and conditioner and allows the slurry to reach the center of the conditioner. This more uniformly conditions the pad surface which yields more uniformly polished wafers and also increases pad life. Brazing is used to form a molecular bond between the abrasive diamond crystals and the nickel alloy conditioner. This bond is not attacked by the low pH slurry used in CMP, eliminating the problem where diamond crystals separate from the conditioner causing scratches on the wafer surface.

摘要翻译： 用于在用于平坦化半导体晶片表面的化学和机械抛光（CMP）工艺中用于去除抛光垫中的浆料和半导体薄膜积聚的抛光垫调节器。 调理剂经常在去离子水被施加时压在抛光垫上，以去除材料堆积。 本发明的护发素具有被金属晶体覆盖的凸下表面，其结合到镍合金调理剂的下侧。 通常，调理表面的中心和边缘之间的差异将在调节表面的整个厚度的最小值（更凸）的范围内为最小约0.2mm（非常微凸）。 凸形减小垫和调节剂之间的摩擦，并允许浆料到达护发素的中心。 这更均匀地调节焊盘表面，产生更均匀的抛光晶片，并且还增加焊盘寿命。 钎焊用于在磨料金刚石晶体和镍合金调节剂之间形成分子键。 这种键不受CMP中使用的低pH浆料的侵害，消除了金刚石晶体与调理剂分离而造成晶片表面划痕的问题。

公开(公告)号：US06203408B1

公开(公告)日：2001-03-20

申请号：US09383597

申请日：1999-08-26

申请人： Ser Wee Quek

发明人： Ser Wee Quek

IPC分类号： B24B100

CPC分类号： B24B37/30 ,  B24B49/16

摘要： An apparatus for removably positioning a semiconductor wafer for polishing. The apparatus including a rotating member with a major lower surface having a plurality of recesses each with a conduit path radially leading to a smaller circular pattern of portholes disposed near the center of the rotating member, the recesses are arranged in concentric segments. A nozzle plate covers the major lower surface defining a plurality of chambers therebetween. The nozzle plate includes a radial pattern of gas dispensing orifices which are aligned centrally relative to each chamber. A preset regulated gas pressure communicates with each orifice pattern to exert an opposing force against a force urging the article against the polishing pad. At least two of the orifice patterns have gas pressures adjusted independently from one another so that independent pressure control creates varying forces to be exerted against the back side of the wafer.

摘要翻译： 一种可拆卸地定位用于抛光的半导体晶片的装置。 该装置包括具有多个凹槽的主要下表面的旋转构件，每个凹槽各自具有径向导向设置在旋转构件的中心附近的更小的孔口的圆形图案的导管路径，凹部以同心段布置。 喷嘴板覆盖在其下面限定多个室之间的主下表面。 喷嘴板包括相对于每个室中心对准的气体分配孔的径向图案。 预设的调节气体压力与每个孔板图形连通，以发挥抵抗抛光垫推动制品的力的相反力。 至少两个孔口图案具有彼此独立调节的气体压力，使得独立的压力控制产生对晶片背面施加的变化的力。

公开(公告)号：US06220936B1

公开(公告)日：2001-04-24

申请号：US09206734

申请日：1998-12-07

申请人： Ser Wee Quek

发明人： Ser Wee Quek

IPC分类号： B24B2900

CPC分类号： B24B53/017 ,  B24B49/04 ,  B24B53/08 ,  B24B53/12 ,  B24D5/02

摘要： The invention teaches an in-site roller dresser that allows for the profile of the polishing pad to be monitored while the roller is dressed or refurbished. This eliminates the need for destructive testing of the polishing pad. The in-site roller dresser at the same time eliminates the need for machine downtime for polishing pad profile determination since the polishing pad profile is dynamically tested and monitored during polishing operations. In conventional arrangements, the dresser is a disk, in the arrangement of the present invention the dresser is a roller type that can rotate around its axis in either direction. A sensor is provided with the diamond dresser that monitors the surface or profile of the polishing pad. Based on the data obtained by the sensor, the diamond dresser can be adjusted which directly controls the polishing pad refurbishing action provided by the dresser.

摘要翻译： 本发明教导了一种现场的滚筒修整器，其允许在滚筒穿着或翻新时监测抛光垫的轮廓。 这消除了对抛光垫的破坏性测试的需要。 在抛光操作期间，由于抛光垫轮廓被动态测试和监控，所以现场滚磨机同时消除了抛光垫轮廓确定的机器停机时间。 在常规布置中，修整器是盘，在本发明的布置中，修整器是可以在任一方向上围绕其轴线旋转的辊型。 传感器配有钻石修整器，用于监测抛光垫的表面或轮廓。 根据传感器获得的数据，可以调整钻石修整器，直接控制修整器提供的抛光垫翻新动作。

公开(公告)号：US06155913A

公开(公告)日：2000-12-05

申请号：US290920

申请日：1999-04-12

申请人： Ser Wee Quek

发明人： Ser Wee Quek

IPC分类号： B24B27/00 ,  B24B37/04 ,  B24B1/00

CPC分类号： B24B27/0076 ,  B24B37/04

摘要： Double or multiple unit polishing heads are used thereby negating the negative effects that irregularities in the surface of the polishing pad have on the polishing results obtained. Adjacent double or multiple unit polishing heads rotate in opposite directions thereby eliminating the effects of microscopic directions in the surface of the polishing pads.

摘要翻译： 使用双重或多个单元抛光头，从而消除抛光垫表面的不规则性对获得的抛光结果的负面影响。 相邻的双或多个单元抛光头沿相反方向旋转，从而消除抛光垫表面的微观方向的影响。