公开(公告)号：US20210283656A1

公开(公告)日：2021-09-16

申请号：US17196840

申请日：2021-03-09

申请人： Ascent Ventures, LLC

发明人： James M. Chwalek ,  Todd A. Jackson

IPC分类号： B06B1/06 ,  H01L41/312

摘要： An ultrasonic transducer includes a delay line substrate, a piezoelectric element, a metal conductive layer between the delay line substrate and the piezoelectric element, and a backing layer applied to the piezoelectric element. The delay line substrate and the piezoelectric element are acoustically joined, configured to couple ultrasonic waves from the piezoelectric element into the delay line substrate or from the delay line substrate into the piezoelectric element. The backing layer includes a metal film, the metal film has a thickness and an acoustic impedance, and the thickness and the acoustic impedance each have value sufficient to provide acoustic damping. The backing layer has a substantially columnar cross-sectional morphology with a substantially granular surface morphology.