公开(公告)号：US06183064B2

公开(公告)日：2001-02-06

申请号：US08827240

申请日：1997-03-28

申请人： Ashok Murthy ,  Richard Earl Corley ,  Tonya Harris Jackson ,  Steven Robert Komplin ,  Gary Raymond Williams

发明人： Ashok Murthy ,  Richard Earl Corley ,  Tonya Harris Jackson ,  Steven Robert Komplin ,  Gary Raymond Williams

IPC分类号： B41J214

CPC分类号： B41J2/1634 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1635 ,  B41J2/1645 ,  Y10T29/49401

摘要： A method for making an inkjet printhead nozzle plate from a composite strip containing a nozzle layer and an adhesive layer is disclosed. The adhesive layer is coated with a polymeric sacrificial layer prior to laser ablating the flow features in the composite strip. A method is also provided form improving adhesion between the adhesive layer and the sacrificial layer. Once the composite strip containing the sacrificial layer is prepared, the coated composite strip is then laser ablated to form flow features in the strip in order to form the nozzle plates. After forming the flow features, the sacrificial layer is removed individual inkjet printhead nozzle plate are separated from the composite strip by singulating the nozzle plates with a laser.

摘要翻译： 公开了一种从包含喷嘴层和粘合剂层的复合带制造喷墨打印头喷嘴板的方法。 在激光烧蚀复合带材中的流动特征之前，将粘合剂层涂覆有聚合物牺牲层。 还提供了一种提高粘合剂层和牺牲层之间的粘附性的方法。 一旦制备了包含牺牲层的复合带材，然后将涂覆的复合带材激光烧蚀以形成条带中的流动特征，以便形成喷嘴板。 在形成流动特征之后，去除牺牲层，通过用激光单分割喷嘴板，单独的喷墨打印头喷嘴板与复合带分离。

公开(公告)号：US08777376B2

公开(公告)日：2014-07-15

申请号：US12788446

申请日：2010-05-27

申请人： Frank Edward Anderson ,  Richard Earl Corley ,  Jiandong Fang

发明人： Frank Edward Anderson ,  Richard Earl Corley ,  Jiandong Fang

IPC分类号： B41J2/14

CPC分类号： B41J2/155 ,  B41J2202/20

摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along skewed fluid vias to enable seamless stitching of fluid ejections. The firing elements are energized to eject fluid and ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Singulating chips from larger wafers provide still further embodiments.

摘要翻译： 微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。 芯片具有沿倾斜的流体通孔布置的流体激发元件，以实现流体喷射的无缝缝合。 激发元件通电以喷射流体，并且根据颜色或流体类型间隔开。 重叠的发射元件在成像期间为冗余努力提供可靠的打印质量。 可变芯片尺寸和形状被公开为不同颜色的液体通孔之间的关系。 倾斜角度各不相同，具有明显的优点。 从较大的晶片制造芯片提供了另外的实施例。

公开(公告)号：US20110292122A1

公开(公告)日：2011-12-01

申请号：US12788446

申请日：2010-05-27

申请人： Frank Edward Anderson ,  Richard Earl Corley ,  Jiandong Fang

发明人： Frank Edward Anderson ,  Richard Earl Corley ,  Jiandong Fang

IPC分类号： B41J2/21 ,  B41J2/145

CPC分类号： B41J2/155 ,  B41J2202/20

摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along skewed fluid vias to enable seamless stitching of fluid ejections. The firing elements are energized to eject fluid and ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Singulating chips from larger wafers provide still further embodiments.

摘要翻译： 微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。 芯片具有沿倾斜的流体通孔布置的流体激发元件，以实现流体喷射的无缝缝合。 激发元件通电以喷射流体，并且根据颜色或流体类型间隔开。 重叠的发射元件在成像期间为冗余努力提供可靠的打印质量。 可变芯片尺寸和形状被公开为不同颜色的液体通孔之间的关系。 倾斜角度各不相同，具有明显的优点。 从较大的晶片制造芯片提供了另外的实施例。

公开(公告)号：US20070232055A1

公开(公告)日：2007-10-04

申请号：US11423720

申请日：2006-06-13

申请人： Richard Earl Corley ,  Shelby Wayne Dennis ,  Edgar Colin Diaz ,  Richard Leo Hubert ,  Jonathan Harold Laurer ,  Tu Phan ,  George Allan Ping ,  Jeanne Marie Saldanha Singh ,  Mary Claire Smoot ,  Paul Timothy Spivey

发明人： Richard Earl Corley ,  Shelby Wayne Dennis ,  Edgar Colin Diaz ,  Richard Leo Hubert ,  Jonathan Harold Laurer ,  Tu Phan ,  George Allan Ping ,  Jeanne Marie Saldanha Singh ,  Mary Claire Smoot ,  Paul Timothy Spivey

IPC分类号： H01L21/4763

CPC分类号： H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and apparatuses for applying a protective material to an interconnect associated with a component. One such method involves placing a stencil in close proximity to an interconnect that extends over a cavity. An amount of protective material is placed on the stencil. A wiper is passed across the stencil. The wiper has an angle of attack of less than 50 degrees. At least a desired thickness of protective material is applied to the interconnect.

摘要翻译： 将保护材料施加到与部件相关联的互连的方法和装置。 一种这样的方法包括将模板放置在靠近空腔上延伸的互连件附近。 将一定量的保护材料放在模板上。 刮水器穿过模板。 刮水器的冲击角小于50度。 至少所需的保护材料厚度被施加到互连。