公开(公告)号：US20240074124A1

公开(公告)日：2024-02-29

申请号：US18351361

申请日：2023-07-12

申请人： Atieva, Inc.

发明人： Samaneh Sadri ,  Jonathan Luna ,  Jerome Jambon ,  Bradley Lucas Hall

IPC分类号： H05K7/20

CPC分类号： H05K7/20927 ,  H05K7/20254 ,  H05K7/20272

摘要： A cooler for power electronics comprises: first mounting surfaces for first power electronics modules, respectively; second mounting surfaces for second power electronics modules, respectively, each of the first mounting surfaces being parallel to and overlapping a corresponding one of the second mounting surfaces; and coolant paths extending between an inlet and an outlet, the coolant paths providing parallel flows among the first and second mounting surfaces.

公开(公告)号：US20240365520A1

公开(公告)日：2024-10-31

申请号：US18329369

申请日：2023-06-05

申请人： Atieva, Inc.

发明人： Samaneh Sadri ,  Duncan Ryan Marks ,  Alexander Gates Moore Tsang

IPC分类号： H05K7/20

CPC分类号： H05K7/20927

摘要： A thermal device for electronics comprises: a baseplate configured for having the electronics mounted thereto; a manifold defining a cavity closed by the baseplate, the cavity having an inlet and an outlet for a fluid; and pin fins extending from a surface of the baseplate inside the cavity, the pin fins arranged in a pattern, wherein a spacing between adjacent ones of the pin fins has a gradient.