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公开(公告)号：US20150307999A1
公开(公告)日：2015-10-29
申请号：US14646743
申请日：2013-07-29
发明人： Norbert LÜTZOW , Gabriela SCHMIDT , Dirk TEWS
CPC分类号： C23F1/18 , C23F1/02 , C23F1/46 , H05K3/067 , H05K2203/0789
摘要： The present invention relates to an aqueous composition for and a process for etching copper and copper alloys applying said aqueous composition. The aqueous composition comprises a source for Fe3+ ions, at least one acid, at least one triazole or tetrazole derivative, and at least one etching additive selected from N-alkylated iminodipropionic acid, salts thereof, modified polyglycol ethers and quaternary ureylene polymers. The aqueous composition is particularly useful for making of fine structures in the manufacture of printed circuit boards, IC substrates and the like.
摘要翻译： 本发明涉及一种用于蚀刻应用所述水性组合物的铜和铜合金的水性组合物和蚀刻方法。 水性组合物包含Fe 3+离子源，至少一种酸，至少一种三唑或四唑衍生物，以及至少一种选自N-烷基化亚氨基二丙酸，其盐，改性聚乙二醇醚和季戊烯聚合物的蚀刻添加剂。 含水组合物特别可用于制造印刷电路板，IC基板等中的精细结构。
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公开(公告)号：US20190003061A1
公开(公告)日：2019-01-03
申请号：US16065200
申请日：2016-12-14
IPC分类号： C23F1/18 , H05K3/38 , H01L21/3213 , H05K3/06
摘要： An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each R1 is a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.
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公开(公告)号：US20210251085A1
公开(公告)日：2021-08-12
申请号：US17052545
申请日：2019-05-06
发明人： Norbert LÜTZOW , Wonjin CHO , Toshio HONDA , Dirk TEWS , Markku LAGER , Felix TANG , Mirko KLOPPISCH , Aaron HAHN , Gabriela SCHMIDT , Martin THOMS
摘要： The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps: (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy, (ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole, (ii-b) one or more than one organic acid and/or salts thereof, (ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and (ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.
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