摘要:
An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.
摘要:
In a method for calibration of a measurement unit for determination of electrical properties of electronic components using at least one planar calibration standard, an electrical measurement quantity is measured at two different temperatures. The electrical property of the calibration standard is known at at least one temperature or is to be determined by calculation. A temperature coefficient is determined from both measured quantities, which describes the relative change of the electrical property of the calibration standard accompanying the temperature change and with which the electrical property of the calibration standard is determined at a measurement temperature. From the change in electrical property, an error coefficient of the measurement unit is determined. A method is also provided for determination of an electrical property of an electronic component, using the calibration method.
摘要:
A chuck for supporting and retaining a test substrate includes a device for supporting and retaining a calibration substrate. The chuck comprises a first support surface for supporting a test substrate and a second support surface, which is laterally offset to the first support surface, for supporting a calibration substrate The calibration substrate has planar calibration standards for calibration of a measuring unit of a prober, and dielectric material or air situated below the calibration substrate at least in the area of the calibration standard. In order to be able to take the actual thermal conditions on the test substrate and in particular also on known and unknown calibration standards and thus the thermal influence on the electrical behavior of the calibration standard used into consideration, the second support surface is equipped for temperature control of the calibration substrate.
摘要:
In a method for measurement of impedance of electronic circuits, an input of the electronic circuit is acted upon by a high-frequency ac voltage with a measurement frequency f as a test signal and, from the reaction of the circuit to the test signal, the impedance Z of the circuit is determined. A parameter S, which represents the value S = Z - Z 0 Z + Z 0 at a stipulated reference impedance Z0, is produced by an analyzer with a reference impedance Z0, and from this parameter S the impedance Z is determined. To minimize the error in measuring the impedances by determining parameter S, the measurement frequency f is set so that a minimal error ΔZ is produced for Z.
摘要翻译:在电子电路的阻抗测定方法中,以测量频率f为测试信号的高频交流电压对电子电路的输入进行动作,从电路与测试信号的反应, 确定电路的阻抗Z。 在规定的基准阻抗Z0下,表示值S = Z-Z 0 Z + Z 0的参数S由具有参考阻抗Z0的分析器产生,并且从该参数S确定阻抗Z。 为了通过确定参数S来最小化测量阻抗的误差,测量频率f被设置为使Z产生最小误差&Dgr; Z。