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公开(公告)号：US20250044534A1
公开(公告)日：2025-02-06
申请号：US18486088
申请日：2023-10-12
Applicant: Ayar Labs, Inc.
Inventor： Chong Zhang , Haiwei Lu , Steve Groothuis
IPC: G02B6/42
Abstract: An electro-optical chip assembly includes a silicon baseplate and an electro-optical chip. The electro-optical chip has a silicon substrate that is fusion bonded to the silicon baseplate. The electro-optical chip is manufactured separate from the silicon baseplate before fusion bonding of the silicon substrate of the electro-optical chip to the silicon baseplate.
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