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公开(公告)号：US11500153B2
公开(公告)日：2022-11-15
申请号：US17070601
申请日：2020-10-14
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , Chong Zhang , Haiwei Lu , Chen Li
Abstract: A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.
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公开(公告)号：US20210080647A1
公开(公告)日：2021-03-18
申请号：US17019158
申请日：2020-09-11
Applicant: Ayar Labs, Inc.
Inventor： Haiwei Lu , Chen Li , John Fini , Chong Zhang , Roy Edward Meade
Abstract: A handle-integrated composite wafer assembly includes a handle wafer attached to a device wafer. The device wafer includes a device layer formed on a buried oxide layer. The device layer includes an optical resonator structure. The handle wafer includes a base layer and a layer of anti-reflective material disposed on a top side of the base layer. The base layer has a cavity extending into the base layer from the top side of the base layer. The cavity has at least one side surface and a bottom surface. The layer of anti-reflective material is substantially conformally disposed within the cavity on the at least one side surface and bottom surface of the cavity. The handle wafer is attached to the device wafer with the layer of anti-reflective material affixed to the buried oxide layer, and with the cavity substantially aligned with the optical resonator structure in the device layer.
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Patent Agency Ranking
公开(公告)号：US20230070458A1
公开(公告)日：2023-03-09
申请号：US17987485
申请日：2022-11-15
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , Chong Zhang , Haiwei Lu , Chen Li
Abstract: A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.
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公开(公告)号：US11156773B2
公开(公告)日：2021-10-26
申请号：US17019158
申请日：2020-09-11
Applicant: Ayar Labs, Inc.
Inventor： Haiwei Lu , Chen Li , John Fini , Chong Zhang , Roy Edward Meade
Abstract: A handle-integrated composite wafer assembly includes a handle wafer attached to a device wafer. The device wafer includes a device layer formed on a buried oxide layer. The device layer includes an optical resonator structure. The handle wafer includes a base layer and a layer of anti-reflective material disposed on a top side of the base layer. The base layer has a cavity extending into the base layer from the top side of the base layer. The cavity has at least one side surface and a bottom surface. The layer of anti-reflective material is substantially conformally disposed within the cavity on the at least one side surface and bottom surface of the cavity. The handle wafer is attached to the device wafer with the layer of anti-reflective material affixed to the buried oxide layer, and with the cavity substantially aligned with the optical resonator structure in the device layer.
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公开(公告)号：US20250044534A1
公开(公告)日：2025-02-06
申请号：US18486088
申请日：2023-10-12
Applicant: Ayar Labs, Inc.
Inventor： Chong Zhang , Haiwei Lu , Steve Groothuis
IPC: G02B6/42
Abstract: An electro-optical chip assembly includes a silicon baseplate and an electro-optical chip. The electro-optical chip has a silicon substrate that is fusion bonded to the silicon baseplate. The electro-optical chip is manufactured separate from the silicon baseplate before fusion bonding of the silicon substrate of the electro-optical chip to the silicon baseplate.
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公开(公告)号：US12019269B2
公开(公告)日：2024-06-25
申请号：US17987485
申请日：2022-11-15
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , Chong Zhang , Haiwei Lu , Chen Li
CPC classification number: G02B6/1225 , G02B6/12011 , G02B2006/1213
Abstract: A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.
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公开(公告)号：US20210109284A1
公开(公告)日：2021-04-15
申请号：US17070601
申请日：2020-10-14
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , Chong Zhang , Haiwei Lu , Chen Li
Abstract: A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.
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