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公开(公告)号:US06987306B2
公开(公告)日:2006-01-17
申请号:US10621203
申请日:2003-07-17
IPC分类号: H01L27/14
CPC分类号: B82Y10/00 , H01L27/1446 , H01L29/7376 , H01S5/0014 , H01S5/02248 , H01S5/18305 , H01S5/423 , H01S5/50
摘要: This invention describes an approach for monolithically integrating all the components of a photoreceiver—optical amplifier, optical band-pass filter, and photodiode module—on a single chip. The photoreceiver array employs unique optical amplifier and conversion technologies that provides the ultra-sensitivity required for free space optical communications networks. As an example, by monolithically integrating a vertical cavity surface emitting laser-diode (VCSEL) optical preamplifier with a photodiode receiver and related amplifiers and filters on the same chip, sensitivities as low as −47 dBm (62 photons/bit at 2.5 Gb/s), along with an order of magnitude reduction in size, weight, and power consumption over comparable commercial-off-the-shelf (COTS) components can be demonstrated. In accordance with another aspect of the present invention, the concept of monolithic integration of optical amplifier with photodetector is extended to lasers, another amplifier and modulators covering ultra violet to very long wavelength infrared using the InP, GaAs, GaSb, InAs, InSb, SiGe, SiC and GaN etc based technologies.
摘要翻译: 本发明描述了在单个芯片上将光接收器 - 光放大器,光带通滤波器和光电二极管模块的所有部件单片集成的方法。 光接收器阵列采用独特的光放大器和转换技术,提供了自由空间光通信网络所需的超灵敏度。 作为示例,通过将垂直腔表面发射激光二极管(VCSEL)光学前置放大器与光电二极管接收器和相关放大器和滤波器整体集成在同一芯片上,灵敏度低至-47dBm(在2.5Gb / s时为62个光子/ (COTS)组件的大小,重量和功耗的数量级可以被证明。 根据本发明的另一方面,光放大器与光电检测器的单片集成的概念被扩展到激光器,另一个放大器和使用InP,GaAs,GaSb,InAs,InSb,SiGe覆盖紫外到非常长波长红外的调制器 ,SiC和GaN等技术。