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公开(公告)号:US20190219914A1
公开(公告)日:2019-07-18
申请号:US16231289
申请日:2018-12-21
申请人: NORTH INC.
发明人: Jörg Pierer , Rony Jose James , Stefan Mohrdiek , Martin Jose Kiik , Syed Moez Haque , Douglas Raymond Dykaar
CPC分类号: G02B27/0172 , G02B6/12004 , G02B6/12007 , G02B6/124 , G02B6/125 , G02B6/13 , G02B6/42 , G02B6/4206 , G02B6/4215 , G02B6/4251 , G02B27/1006 , G02B27/4205 , G02B2006/12069 , G02B2006/12107 , G02B2006/12147 , G02B2006/12164 , G02B2027/011 , G02B2027/0112 , G02B2027/0116 , G02B2027/0178 , G03B21/2033 , H01S5/0206 , H01S5/02208 , H01S5/02248 , H01S5/0226 , H01S5/02272 , H01S5/02288 , H01S5/02296 , H01S5/0261 , H01S5/042 , H01S5/4012 , H01S5/4031 , H01S5/4093 , H01S5/423 , H04N9/3161
摘要: Systems, devices, and methods of manufacturing optical engines and laser projectors that are well-suited for use in wearable heads-up displays (WHUDs) are described. Generally, the optical engines of the present disclosure integrate a plurality of laser diodes (e.g., 3 laser diodes, 4 laser diodes) within a single, hermetically or partially hermetically sealed, encapsulated package. Photonic integrated circuits having grating or edge couplers thereon may be used to wavelength multiplex beams of light emitted by the plurality of laser diodes into a coaxially superimposed aggregate beam. A waveguide medium having one or more directly written waveguides may couple light from laser diodes to a photonic integrated circuit, and may optionally hermetically or partially hermetically seal the laser diodes, eliminating the need for a separate seal. Such optical engines may have advantages over existing designs including, for example, smaller volumes, better manufacturability, faster modulation speed, etc. WHUDs that employ such optical engines and laser projectors are also described.
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公开(公告)号:US20190199058A1
公开(公告)日:2019-06-27
申请号:US16216899
申请日:2018-12-11
申请人: North Inc.
CPC分类号: G02B27/0172 , G02B6/12004 , G02B6/124 , G02B6/13 , G02B6/42 , G02B6/4214 , G02B27/0101 , G02B27/0176 , G02B27/1086 , G02B27/141 , G02B27/18 , G02B27/4205 , G02B2006/12107 , G02B2006/12147 , G02B2006/12164 , G02B2027/011 , G02B2027/0114 , G02B2027/0116 , G02B2027/0134 , G02B2027/014 , G02B2027/015 , G02B2027/0178 , G03B21/008 , G03B21/2033 , G03B21/2066 , G03B33/12 , H01S5/02208 , H01S5/02224 , H01S5/02248 , H01S5/0226 , H01S5/02272 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H01S5/4012 , H01S5/4093 , H04N9/3129 , H04N9/3161
摘要: Systems, devices, and methods of manufacturing optical engines and laser projectors that are well-suited for use in wearable heads-up displays (WHUDs) are described. Generally, the optical engines of the present disclosure integrate a plurality of laser diodes (e.g., 3 laser diodes, 4 laser diodes) within a single, hermetically or partially hermetically sealed, encapsulated package. Photonic integrated circuits having grating couplers thereon may be used to wavelength multiplex beams of light emitted by the plurality of laser diodes into a coaxially superimposed aggregate beam. Such optical engines may have various advantages over existing designs including, for example, smaller volumes, better manufacturability, faster modulation speed, etc. WHUDs that employ such optical engines and laser projectors are also described.
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公开(公告)号:US20190190608A1
公开(公告)日:2019-06-20
申请号:US16226040
申请日:2018-12-19
申请人: Finisar Corporation
发明人: Nicolae CHITICA , Jürgen HAUENSCHILD , Theron JONES , David NIDELIUS , Lennart LUNDQVIST , Elisabeth KÄLLÉN , Odd STEIJER , Marek CHACINSKI , Åsa JOHANSSON , Andrei KAIKKONEN
CPC分类号: H04B10/40 , G02B6/4273 , H01S5/02248 , H01S5/02296 , H01S5/02438 , H01S5/02446 , H01S5/02469 , H01S5/0261 , H01S5/0262 , H01S5/06226 , H01S5/06817 , H01S5/423 , H04B10/503
摘要: An integrated optical transceiver, comprising a laser component, comprising an array of VCSEL diodes formed on a laser diode substrate; a laser driving component, comprising laser diode driving circuitry formed on a laser driving circuitry substrate; a photodiode component, comprising an array of photodiodes formed on a photodiode substrate; and a photodiode driving component, comprising photodiode driving circuitry formed on a photodiode driving circuitry substrate; a first heat sink comprising a connected piece of material to transport excess heat away from the integrated optical transceiver and connected to both the laser and photodiode driving components; and an electrically insulating material separating the photodiode substrate from the first heat sink and being air or dielectric material with a relative dielectric constant ε
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公开(公告)号:US20190181955A1
公开(公告)日:2019-06-13
申请号:US16181996
申请日:2018-11-06
发明人: Sylvie MENEZO
CPC分类号: H04B10/5057 , H01S5/021 , H01S5/02248 , H01S5/0617 , H01S5/06817 , H01S5/0683 , H01S5/06832 , H01S5/0687 , H04B10/675 , H04B10/691
摘要: An emitter of an optical signal includes a laser source including a control input for receiving an injection current able to modify the frequency of the optical signal, this laser source emitting the optical signal at a frequency v0 in the absence of injection current, a feedback loop able to produce an injection current that is able to decrease the linewidth of the optical signal, this feedback loop including to this end an optical filter a pass band of which contains a preset operating point corresponding to a frequency vb, and a loop for automatically controlling the frequency vb to the frequency v0, and wherein the feedback loop includes an electrical filter that is able to selectively attenuate, in the produced injection current, the amplitude of frequency components generated by the automatic-control loop.
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公开(公告)号:US20190081455A1
公开(公告)日:2019-03-14
申请号:US15729380
申请日:2017-10-10
发明人: TZU-CHING YEH , YU-FU WU , CHENG-TA CHEN
IPC分类号: H01S5/0683 , H01S5/183 , H01S5/022
CPC分类号: H01S5/0683 , H01S5/0071 , H01S5/02212 , H01S5/02248 , H01S5/02252 , H01S5/02292 , H01S5/02296 , H01S5/183
摘要: A packaging assembly for a high-speed vertical-cavity surface-emitting laser (VCSEL) mainly applies a lens assembly consisted of several prisms to split a laser beam emitted by a VCSEL element so as to guide a small portion of the laser beam back to a monitor photodiode (MPD) and the rest of the laser beam to travel away along an optical axis. Such a spectacular design of the lens assembly can not only relieve the VCSEL element from a position right under the optical axis, but can also reduce signal loss by shorting a length of a bonding wire for a corresponding pin through disposing the VCSEL element further close to the corresponding pin. Thereupon, a defect of lights reflected from a lens or a translucent plate on a cap can be substantially improved.
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公开(公告)号:US20190013640A1
公开(公告)日:2019-01-10
申请号:US15642752
申请日:2017-07-06
CPC分类号: H01S5/021 , H01S3/1062 , H01S5/0064 , H01S5/02248 , H01S5/026 , H01S5/0265 , H01S5/0287 , H01S5/101 , H01S5/1014 , H01S5/1032 , H01S5/142 , H01S5/227 , H01S5/3216 , H01S5/34306 , H01S5/4062 , H01S5/4068
摘要: Examples of the present disclosure include a tunable laser comprising a waveguide including gain section. The waveguide overlies and is optically coupled to another waveguide. The another waveguide has a reflector at one end. A laser cavity is formed in the waveguides.
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公开(公告)号:US20180287334A1
公开(公告)日:2018-10-04
申请号:US15939219
申请日:2018-03-28
申请人: NICHIA CORPORATION
发明人: Tadaaki MIYATA , Yoshihiro KIMURA
CPC分类号: H01S5/02208 , H01S5/0071 , H01S5/0215 , H01S5/02216 , H01S5/02248 , H01S5/02276 , H01S5/02292 , H01S5/02296 , H01S5/221 , H01S5/4087
摘要: Provided is a light source device, including: a base member; a semiconductor laser disposed on the base member; a lateral wall portion formed so as to surround the semiconductor laser; a light-transmissive lid covering a gap surrounded by the base member and the lateral wall portion; and a connection member that airtightly connects an upper surface of the lateral wall portion and a lower surface of the lid over an entire perimeter of the lateral wall portion. The lateral wall portion has a reflecting surface which is an inside surface connected to an upper surface, the reflecting surface being inclined so that light emitted from the semiconductor laser is reflected toward the lid. A dielectric film is continuously formed on the reflecting surface and the upper surface. A height of the connection member is greater than a height of the dielectric film formed on the upper surface.
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公开(公告)号:US20180278008A1
公开(公告)日:2018-09-27
申请号:US15937584
申请日:2018-03-27
CPC分类号: H01S3/0941 , G02B6/4206 , H01S3/06704 , H01S5/005 , H01S5/0071 , H01S5/02248 , H01S5/02288 , H01S5/02469 , H01S5/4012 , H01S5/4025 , H01S5/4031 , H01S5/4075
摘要: A laser diode assembly, comprising a plurality of laser diodes each configured to emit respective ones of a plurality of laser beams along parallel and nonoverlapping optical axes and a first beam offset plate (BOP) configured to receive a first of the laser beams on a first input surface, the first laser beam having a first input optical axis, the first BOP configured to transmit a first output laser beam that has a first vertical offset from the first input optical axis.
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公开(公告)号:US20180166850A1
公开(公告)日:2018-06-14
申请号:US15894170
申请日:2018-02-12
CPC分类号: H01S5/0206 , B81B7/0067 , B81C1/00301 , H01S5/0064 , H01S5/02216 , H01S5/02248 , H01S5/02284 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H01S5/4025 , H01S5/4087 , H04B10/40 , H04J14/02
摘要: A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. The electrical signal may be communicated to external devices by at least one additional through silicon via, and the signals routed to the encapsulated devices by metal traces. The vias may couple a ground plane to a metal trace layer at intervals, effectively quashing the ability of the bondline to interfere with the absorbed or radiated signal frequency.
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公开(公告)号:US20180149818A1
公开(公告)日:2018-05-31
申请号:US15819829
申请日:2017-11-21
发明人: Yasuyuki Yamauchi
IPC分类号: G02B6/42 , H01L23/00 , H04B10/2575
CPC分类号: G02B6/4279 , G02B6/4204 , G02B6/4206 , G02B6/4271 , G02B6/4292 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/1421 , H01S5/005 , H01S5/02216 , H01S5/02248 , H01S5/02276 , H01S5/02284 , H01S5/02415 , H01S5/02438 , H01S5/0265 , H04B10/2575 , H01L2224/45099
摘要: A semiconductor module is disclosed. The semiconductor module includes a housing that encloses on a bottom thereof a spacer and a wiring substrate that mounts a semiconductor element thereon. The housing includes a feedthrough that secures one end of a transmission substrate. The other end of the transmission substrate faces the wiring substrate and the spacer. The other end of the transmission substrate provides a lower end and an upper end that form an extension protruding toward the wiring substrate. The upper end is set so close to the wiring substrate but the lower end forms a space for receiving a surplus adhesive oozing between the spacer and the wiring substrate.
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