利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.024 秒)

    BGA device positioner kit
    1.
    发明授权
    BGA device positioner kit 失效
    BGA器件定位器套件

    公开(公告)号：US06433564B1

    公开(公告)日：2002-08-13

    申请号：US09332380

    申请日：1999-06-14

    申请人： B. S. Chandra Shekar ,  Liop-Jin Yap ,  Chee-Keong Tan

    发明人： B. S. Chandra Shekar ,  Liop-Jin Yap ,  Chee-Keong Tan

    IPC分类号： G01R3102

    CPC分类号： G01R1/0483

    摘要： An apparatus was described which allows accurate and fast positioning of device kits for the input shuttle, the output shuttle, the docking plates, hot plate and testing stations within the semiconductor device manufacturing and testing applications for Ball Grid Array sockets. A method was highlighted by means of which the sockets in these shuttles and plates can be adapted to different sizes and different types of semiconductor devices. A pick up shaft described resulted in added flexibility within the semiconductor device manufacturing and testing environment.

    摘要翻译： 描述了一种装置，其允许准确和快速地定位用于球栅阵列插座的半导体器件制造和测试应用中的输入梭，输出梭，对接板，热板和测试台的装置套件。 突出了一种方法，通过这种方法，这些梭子和板中的插座可以适应于不同尺寸和不同类型的半导体器件。 描述的拾取轴在半导体器件制造和测试环境中增加了灵活性。

    Testing of BGA and other CSP packages using probing techniques
    3.
    发明授权
    Testing of BGA and other CSP packages using probing techniques 有权
    使用探测技术测试BGA和其他CSP封装

    公开(公告)号：US06791346B2

    公开(公告)日：2004-09-14

    申请号：US10140573

    申请日：2002-05-08

    申请人： Rajiv Mehta ,  Liop-Jin Yap ,  Raymundo M. Camenforte ,  Chee-Keong Tan

    发明人： Rajiv Mehta ,  Liop-Jin Yap ,  Raymundo M. Camenforte ,  Chee-Keong Tan

    IPC分类号： G01R3102

    CPC分类号： G01R31/2887

    摘要： A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

    摘要翻译： 一种在测试这些设备时处理小型半导体器件的方法和装置。 多个装置安装在装置带状载体内并且位于测试位置。 使用装置带载体对准工具执行装置带状载体的这种定位; 装置带载体可以容易地相对于测试头/探针卡重新定位，以测试包含在装置带状载体内的多个装置。

    Method and apparatus for establishing quick and reliable connection between a semiconductor device handler plate and a semiconductor device test head plate
    5.
    发明授权
    Method and apparatus for establishing quick and reliable connection between a semiconductor device handler plate and a semiconductor device test head plate 有权
    用于在半导体器件处理器板和半导体器件测试头板之间建立快速可靠的连接的方法和装置

    公开(公告)号：US06586925B2

    公开(公告)日：2003-07-01

    申请号：US09828677

    申请日：2001-04-09

    申请人： Ramamoorthi Ramesh ,  Liop-Jin Yap

    发明人： Ramamoorthi Ramesh ,  Liop-Jin Yap

    IPC分类号： G01R3102

    CPC分类号： G01R1/0433

    摘要： A new method and apparatus is provided to quickly and reliably position, connect and dock a handler plate with a test head plate of a Universal Docking System. A handler plate is provided with roller assemblies while a test head plate is provided with matching receiver block assemblies. The roller assemblies are aligned with and partially inserted into the receiver block assemblies. Part of the roller assembly is mechanically engaged by the receiver block assembly, a mechanical linkage between an operator handle and the receiver block assembly allows the operator to complete the locking of the test head plate with the handler plate thereby at the same time establishing electrical contacts between arrays of pins that are mounted on surfaces of the handler base plate and the test head.

    摘要翻译： 提供了一种新的方法和装置，用于快速且可靠地将处理器板与通用对接系统的测试头板定位，连接和对接。 处理机板上设有滚子组件，而测试头板上设置有匹配的接收器组件。 辊组件与接收器块组件对准并部分地插入到接收器组件中。 辊组件的一部分由接收器块组件机械地接合，操作者手柄与接收器块组件之间的机械连接允许操作者完成与操纵板的测试头板的锁定，从而同时建立电触头 在安装在处理器底板和测试头的表面上的销的阵列之间。