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公开(公告)号:US11693025B2
公开(公告)日:2023-07-04
申请号:US17461967
申请日:2021-08-30
发明人: Jian-Ting Chen , Cheng-Han Huang , Kuang-Hua Wang
CPC分类号: G01R1/0433 , H01R12/7076
摘要: A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.
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公开(公告)号:US09933457B2
公开(公告)日:2018-04-03
申请号:US14643559
申请日:2015-03-10
CPC分类号: G01R3/00 , B08B1/00 , G01R1/0408 , G01R1/0433 , G01R1/067 , G01R1/07307 , G01R31/31905
摘要: Embodiments of the invention is based on a device for testing electronic components with at least one test socket with test contacts, with a nest, in which at least one electronic component can be placed, and with at least one cleaning unit for the test contacts of the test socket, wherein by means of a relative movement, which can be carried out as a test stroke, between the test socket and nest the electronic component can be pressed against, and lifted from, the test contacts of the test socket. According to embodiments of the invention the at least one cleaning unit is designed in such a manner that during each test stroke the test contacts come into contact with the at least one cleaning unit.
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公开(公告)号:US09885748B2
公开(公告)日:2018-02-06
申请号:US14734341
申请日:2015-06-09
CPC分类号: G01R31/2886 , G01R1/0433 , G01R1/0491 , G01R31/2867
摘要: A module plate is provided for use with a wafer handler and testing mechanism. The module plate has a diameter equivalent to an integrated circuit wafer and a height equivalent to or less than a height of a module lid associated with each module in a plurality of modules associated with the module plate. The module plate has a plurality of cutouts in the module plate that have a width equivalent to a width of the module lid and at least a length equivalent to a length of the module lid. The height of the module plate is such that, when a test head contacts a module base of each module in a plurality of modules, the module lid contacts a chuck on which the module plate resides during testing of the module thereby providing resistance in order to accurately test the module.
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公开(公告)号:US09835649B1
公开(公告)日:2017-12-05
申请号:US14752363
申请日:2015-06-26
发明人: Jeffery Neil Hulett
CPC分类号: G01R1/0433 , G01R1/0425 , G01R1/07314 , G01R31/2635 , G01R31/2877 , G01R31/44
摘要: A reconfigurable load board clamp is disclosed. The reconfigurable load board clamp includes first and second slotted ends; first and second opposing sides laterally coupled to the first and second slotted ends; and a MCPCB pin board removably coupled to the first and second slotted ends. The pin board includes a card edge connector plugged into an end of the pin board and multiple spring-loaded pin connectors. In implementations, multiple pin boards may be removed and added to the reconfigurable load board clamp to form a pin array suitable for a particular load board.
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公开(公告)号:US09823299B2
公开(公告)日:2017-11-21
申请号:US14784071
申请日:2014-02-11
申请人: Jong Cheon Shin , Dong Ho Ha
发明人: Jong Cheon Shin , Dong Ho Ha
CPC分类号: G01R31/2884 , G01R1/0433 , G01R3/00
摘要: Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.
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公开(公告)号:US09772373B2
公开(公告)日:2017-09-26
申请号:US14472385
申请日:2014-08-29
发明人: Mitsunori Aizawa , Yuya Yamada
CPC分类号: G01R31/2887 , G01R1/0433 , G01R31/043 , G01R31/2891 , G01R31/2893
摘要: Provided is a handler apparatus that conveys a device under test to a test socket, including: an actuator that, prior to fitting of a device holder to the test socket, fits the device holder, and adjusts a position of the device under test on the device holder; and a conveyer that conveys the device holder in which a position of the device under test has been adjusted, to fit the test socket, where the device holder includes: an inner unit to mount the device under test; an outer unit to retain the inner unit to be movable; and a release button to release a lock of movement of the inner unit, in response to being pressed from a side to which the device under test is mounted, and the actuator sets the inner unit to be movable by pressing the release button and adjusts a position of the inner unit.
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公开(公告)号:US20170248630A1
公开(公告)日:2017-08-31
申请号:US15441366
申请日:2017-02-24
申请人: YOKOWO CO., LTD.
发明人: Tsugio YAMAMOTO , Kenichi SATO , Takayoshi OKUNO
CPC分类号: G01R1/0433 , G01R1/0441 , G01R1/06722 , G01R31/2886
摘要: A socket includes: a contact probe; and an insulating support body supporting the contact probe. The contact probe includes: a first plunger to be connected with an object to be inspected; a second plunger to be connected with an inspecting board; and a spring configured to urge the first plunger and the second plunger in a direction apart from each other. In a state where a tip end of the first plunger is released, a projecting amount of the second plunger from the insulating support body is zero with a natural length of the spring.
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公开(公告)号:US20170023633A1
公开(公告)日:2017-01-26
申请号:US15164926
申请日:2016-05-26
发明人: Ki-jae SONG
CPC分类号: G01R31/2879 , G01R1/0433 , G01R31/2863
摘要: A test board includes a plurality of power pads on a substrate. The power pads output a power supply voltage to a plurality of power terminals of a semiconductor device under test. The test board also includes a current limit circuit to limit current flowing through each of the power pads.
摘要翻译: 测试板包括在基板上的多个电源焊盘。 电源板向被测半导体器件的多个电源端子输出电源电压。 测试板还包括一个限流电路,用于限制流过每个电源板的电流。
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公开(公告)号:US20160365268A1
公开(公告)日:2016-12-15
申请号:US14734341
申请日:2015-06-09
IPC分类号: H01L21/683
CPC分类号: G01R31/2886 , G01R1/0433 , G01R1/0491 , G01R31/2867
摘要: A module plate is provided for use with a wafer handler and testing mechanism. The module plate has a diameter equivalent to an integrated circuit wafer and a height equivalent to or less than a height of a module lid associated with each module in a plurality of modules associated with the module plate. The module plate has a plurality of cutouts in the module plate that have a width equivalent to a width of the module lid and at least a length equivalent to a length of the module lid. The height of the module plate is such that, when a test head contacts a module base of each module in a plurality of modules, the module lid contacts a chuck on which the module plate resides during testing of the module thereby providing resistance in order to accurately test the module.
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公开(公告)号:US09459288B2
公开(公告)日:2016-10-04
申请号:US14157181
申请日:2014-01-16
发明人: Rianda Rizza
CPC分类号: G01R1/07378 , G01R1/0433 , G01R31/2886
摘要: A test interposer includes an interposer layer configured to receive a test socket, and a stiffening layer attached to the interposer layer so that the interposer layer is kept in an unalterable shape.
摘要翻译: 测试插入器包括被配置为接收测试插座的插入层,以及附接到插入层的加强层,使得插入层保持不可改变的形状。
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