Light emitting assembly and method thereof

    公开(公告)号:US10720753B2

    公开(公告)日:2020-07-21

    申请号:US16101674

    申请日:2018-08-13

    Abstract: A mount connects a light emitting device, such as a laser diode assembly, to an optical bench. The mount may include a thermoelectrical module coupled to a sub-element of a heat exchanger extending through an opening formed in the optical bench. The thermoelectrical module acts as a heat sink to draw heat outwardly from the laser diode and cool the same. The heat sink enables the laser diode to transmit heat thereto such that substantially all of the heat generated by the laser diode sinks to the heat exchanger. As such, the laser diode transfers virtually no heat to the optical bench so the optical bench is free of deflections or distortions resultant from the heat generated during generation of the laser beam.

    LIGHT EMITTING ASSEMBLY AND METHOD THEREOF
    2.
    发明申请

    公开(公告)号:US20200052461A1

    公开(公告)日:2020-02-13

    申请号:US16101674

    申请日:2018-08-13

    Abstract: A mount connects a light emitting device, such as a laser diode assembly, to an optical bench. The mount may include a thermoelectrical module coupled to a sub-element of a heat exchanger extending through an opening formed in the optical bench. The thermoelectrical module acts as a heat sink to draw heat outwardly from the laser diode and cool the same. The heat sink enables the laser diode to transmit heat thereto such that substantially all of the heat generated by the laser diode sinks to the heat exchanger. As such, the laser diode transfers virtually no heat to the optical bench so the optical bench is free of deflections or distortions resultant from the heat generated during generation of the laser beam.

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