公开(公告)号：US09538692B2

公开(公告)日：2017-01-03

申请号：US14429099

申请日：2014-07-09

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Kevin W. Sliech ,  Stephen A. Hedges ,  Jared P. Majcher

IPC: H02B1/56 ,  H05K7/20 ,  H01R4/48 ,  H01R12/52 ,  H01Q21/00 ,  H02B1/20 ,  H01L23/473

CPC classification number: H02B1/56 ,  H01L23/473 ,  H01Q21/0087 ,  H01R4/48 ,  H01R12/52 ,  H02B1/20 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/209 ,  H05K7/20927

Abstract: An integrated heat exchanger and power delivery system for high powered electronic modules is disclosed. In one embodiment, the system includes a coolant manifold. The system further includes a heat exchanger and power delivery module. The heat exchanger and power delivery module comprises a plurality of heat exchanger and power delivery elements that are coupled to the coolant manifold. The system furthermore includes a high powered electronic module, wherein the high powered module comprises an array of sub-modules. The array of sub-modules is disposed on the plurality of heat exchanger and power delivery elements. The plurality of heat exchanger and power delivery elements are configured to substantially simultaneously deliver power and extract heat away from the sub-modules.

Abstract translation: 公开了一种用于大功率电子模块的集成热交换器和功率输送系统。 在一个实施例中，系统包括冷却剂歧管。 该系统还包括热交换器和电力输送模块。 热交换器和动力输送模块包括耦合到冷却剂歧管的多个热交换器和动力输送元件。 该系统还包括高功率电子模块，其中高功率模块包括子模块阵列。 子模块阵列设置在多​​个热交换器和电力输送元件上。 多个热交换器和动力输送元件构造成基本上同时地输送动力并将热量从子模块中提取出来。

公开(公告)号：US20150222099A1

公开(公告)日：2015-08-06

申请号：US14429099

申请日：2014-07-09

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Kevin W. Sliech ,  Stephen A. Hedges ,  Jared P. Majcher

IPC: H02B1/56 ,  H02B1/20

CPC classification number: H02B1/56 ,  H01L23/473 ,  H01Q21/0087 ,  H01R4/48 ,  H01R12/52 ,  H02B1/20 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/209 ,  H05K7/20927

Abstract: An integrated heat exchanger and power delivery system for high powered electronic modules is disclosed. In one embodiment, the system includes a coolant manifold. The system further includes a heat exchanger and power delivery module. The heat exchanger and power delivery module comprises a plurality of heat exchanger and power delivery elements that are coupled to the coolant manifold. The system furthermore includes a high powered electronic module, wherein the high powered module comprises an array of sub-modules. The array of sub-modules is disposed on the plurality of heat exchanger and power delivery elements. The plurality of heat exchanger and power delivery elements are configured to substantially simultaneously deliver power and extract heat away from the sub-modules.

Abstract translation: 公开了一种用于大功率电子模块的集成热交换器和功率输送系统。 在一个实施例中，系统包括冷却剂歧管。 该系统还包括热交换器和电力输送模块。 热交换器和动力输送模块包括耦合到冷却剂歧管的多个热交换器和动力输送元件。 该系统还包括高功率电子模块，其中高功率模块包括子模块阵列。 子模块阵列设置在多​​个热交换器和电力输送元件上。 多个热交换器和动力输送元件构造成基本上同时地输送动力并将热量从子模块中提取出来。