公开(公告)号：US20240196578A1

公开(公告)日：2024-06-13

申请号：US18077946

申请日：2022-12-08

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Sean P. Smith ,  Mark J. Dube ,  Thomas W. Auletto ,  Bernard A. Sacco, JR. ,  Mark L. Hummel ,  Eric Walther-Grant

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/0032 ,  H05K1/0209 ,  H05K9/0031

Abstract: A lightweight thermally dissipative EMI shield for electronics is composed of both metallic (e.g., conductive) and non-metallic (e.g., nonconductive) materials. The thermally dissipative EMI shield or cover may be formed of multiple layers of metallic or conductive materials and at least one layer of non-metallic or nonconductive material. There may be a conductive base layer, a lower intermediate nonconductive layer, an upper intermediate conductive layer, and an outer nonconductive layer. The conductive layers operate to thermally dissipate heat and suppress EMI, whereas the nonconductive layers provide lightweight rigidity and stiffness to support the EMI shield and protect components from foreign object ingress or damage of a circuit card or cover is coupled.