公开(公告)号：US20220149529A1

公开(公告)日：2022-05-12

申请号：US17091679

申请日：2020-11-06

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Gregory J. Wunsch ,  Christopher K. Cheung ,  Christopher R. Stroili

IPC: H01Q13/02 ,  H01Q1/42 ,  H01Q13/18 ,  H01P3/00

Abstract: A slot antenna includes a substrate having a first side and a second side, a first conductive layer on the first side of the substrate, and a second conductive layer on the second side of the substrate. A first aperture is in the first conductive layer, a second aperture is in the first conductive layer, a first slotline is in the first conductive layer and in communication with the first aperture, and a second slotline is in the first conductive layer and in communication with the second aperture. A third aperture can be in the second conductive layer. A plurality of vias can be in the substrate and surrounding at least a portion of a region including the first aperture, the second aperture, the first slotline, and the second slotline, each of the vias extending through the substrate from the first conductive layer to the second conductive layer.

公开(公告)号：US20220142004A1

公开(公告)日：2022-05-05

申请号：US17090341

申请日：2020-11-05

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Jonathan C. Griffin ,  Ross T. Johnson ,  Gregory J. Wunsch

IPC: H05K7/20 ,  F41G7/22 ,  H04B15/02

Abstract: A heat dissipation structure is disclosed that is especially well-suited for use on aerodynamic systems. The heat dissipation structure is formed within a metallic body that surrounds the heat-generating electronics. The heat dissipation structure is designed to both dissipate the generated heat and also to isolate RF cross-talk between the one or more transmitters and receivers. The heat dissipation structure includes a plurality of ring structures that extend around at least a portion of a body that houses the one or more heat-generating electrical components. The plurality of ring structures may be recessed into the body, and a first spacing between a first adjacent pair of ring structures of the plurality of ring structures is different from a second spacing between a second adjacent pair of ring structures of the plurality of ring structures.

公开(公告)号：US11749897B2

公开(公告)日：2023-09-05

申请号：US17091679

申请日：2020-11-06

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Gregory J. Wunsch ,  Christopher K. Cheung ,  Christopher R. Stroili

IPC: H01Q1/38 ,  H01Q13/10 ,  H01Q13/02 ,  H01P3/00 ,  H01Q13/18 ,  H01Q1/42

CPC classification number: H01Q13/0233 ,  H01P3/003 ,  H01Q1/42 ,  H01Q13/18

Abstract: A slot antenna includes a substrate having a first side and a second side, a first conductive layer on the first side of the substrate, and a second conductive layer on the second side of the substrate. A first aperture is in the first conductive layer, a second aperture is in the first conductive layer, a first slotline is in the first conductive layer and in communication with the first aperture, and a second slotline is in the first conductive layer and in communication with the second aperture. A third aperture can be in the second conductive layer. A plurality of vias can be in the substrate and surrounding at least a portion of a region including the first aperture, the second aperture, the first slotline, and the second slotline, each of the vias extending through the substrate from the first conductive layer to the second conductive layer.

公开(公告)号：US11606882B2

公开(公告)日：2023-03-14

申请号：US17090341

申请日：2020-11-05

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Jonathan C. Griffin ,  Ross T. Johnson ,  Gregory J. Wunsch

IPC: H05K7/20 ,  H04B15/02 ,  F41G7/22

Abstract: A heat dissipation structure is disclosed that is especially well-suited for use on aerodynamic systems. The heat dissipation structure is formed within a metallic body that surrounds the heat-generating electronics. The heat dissipation structure is designed to both dissipate the generated heat and also to isolate RF cross-talk between the one or more transmitters and receivers. The heat dissipation structure includes a plurality of ring structures that extend around at least a portion of a body that houses the one or more heat-generating electrical components. The plurality of ring structures may be recessed into the body, and a first spacing between a first adjacent pair of ring structures of the plurality of ring structures is different from a second spacing between a second adjacent pair of ring structures of the plurality of ring structures.

公开(公告)号：US10276931B1

公开(公告)日：2019-04-30

申请号：US15840387

申请日：2017-12-13

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Gregory J. Wunsch

IPC: H01Q11/12 ,  H01Q1/38 ,  H01Q13/12 ,  H01Q5/25 ,  H01Q9/04 ,  H01Q11/14 ,  H01Q5/357 ,  H01Q13/10 ,  H01Q5/378 ,  H01Q1/24 ,  H01Q1/22 ,  H01Q7/00

Abstract: A reduced profile panel antenna is disclosed. A panel antenna configured according to an embodiment includes two opposing antenna arms disposed over a ground plane. The antenna arms include one or more corrugated or folded sections to increase the electrical path of the antenna arms within fixed physical dimensions (e.g., length and width) of the panel antenna. The panel antenna also includes passive filters to provide current loop paths of varying lengths for selected frequency ranges. Longer loop paths are employed for signals at lower frequencies (i.e., longer wavelengths) and shorter loop paths are employed for signals at higher frequencies (i.e., shorter wavelengths). The panel antenna further includes a ferrite plane disposed between the ground plane and the antenna arms to suppress radio frequency (RF) signal reflections and allow for a reduced antenna profile or thickness.

公开(公告)号：US10062967B2

公开(公告)日：2018-08-28

申请号：US15083815

申请日：2016-03-29

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Gregory J. Wunsch ,  William A. Spurgeon ,  James P. Wolbert ,  James P. Zona

IPC: H01Q1/32 ,  H01Q9/28 ,  H01Q1/40

CPC classification number: H01Q9/28 ,  H01Q1/3283 ,  H01Q1/40

Abstract: A high powered armor panel having the wideband embedded antenna for operation in severe environmental conditions. The armor panel comprises a driven bowtie dipole electrically coupled to at least one driven resistor, a parasitic bowtie dipole electrically coupled to at least one parasitic resistor, a composite structure which has the driven bowtie dipole and the parasitic bowtie dipole embedded therein, a heat sink supported on a first side of the composite structure for dissipating heat, and an armor layer supported on an opposite second first side of the composite structure. The heat sink supports the at least one driven resistor electrically coupled to the driven bowtie dipole and the at least one parasitic resistor electrically coupled to the parasitic bowtie dipole.