公开(公告)号：US20190166717A1

公开(公告)日：2019-05-30

申请号：US15823997

申请日：2017-11-28

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Thomas M. GASS ,  Edward THOMAN, JR.

IPC: H05K7/20 ,  F25B9/00 ,  F25B9/06 ,  G01K3/00

Abstract: A system and method for cooling electronics with compressed gas cylinders. A small, lightweight, scalable cooling system provides portability and cooling for electronic components in remote areas. In some cases one or more compressed gas cylinders are used with a metering valve and a temperature sensor to release gas into an expansion chamber or channels in thermal contact with a heat sink that is in thermal contact with an electric component.