公开(公告)号：US20190259676A1

公开(公告)日：2019-08-22

申请号：US15900838

申请日：2018-02-21

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Timothy M. DRESSER

IPC: H01L23/10 ,  H01L23/552 ,  H01L23/055 ,  H01L23/498 ,  H01L21/48

Abstract: The system and method for a chip-scale surface-mount technology (SMT) packaging method for semiconductor devices. The chip-scale SMT package uses an air-cavity lid to protect the active face of a MMIC, or other device either active or passive, from the environment. In some examples, the cover provides electrical routing. In some examples, the cover also provides electromagnetic shielding. In some cases, the Au semiconductor devices bond pads which are converted to a Pb/Sn compatible metal.

公开(公告)号：US20190311962A1

公开(公告)日：2019-10-10

申请号：US15949159

申请日：2018-04-10

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Timothy M. DRESSER

IPC: H01L23/10 ,  H01L23/552 ,  H01L23/48 ,  H01L23/04 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

Abstract: The system and method for a heterogeneous integrated circuit packaging method having an air-cavity lid to protect the active face of an integrated circuit, or other device, either active or passive, from the environment. The packaging is hermetic or near hermetic. In some examples, the cover provides electrical routing. In some examples, the cover also provides electromagnetic shielding. In some cases, an encapsulant and/or an overmoulding is provided to further protect the heterogeneous integrated circuit.

公开(公告)号：US20170086311A1

公开(公告)日：2017-03-23

申请号：US14744382

申请日：2015-06-19

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Timothy M. DRESSER

IPC: H05K5/00 ,  H05K5/06

CPC classification number: H05K9/0056

Abstract: A hermetically sealed module which comprises a central core housing including a perimeter side wall and a central core with opposed primary and secondary support surfaces. At least one coupling passageway is formed within the central core adjacent the perimeter side wall. The side wall has an sealed internal/external electrical connector which facilitates communication with the module. A multilayer substrate, with at least one flexible coupling tab, is supported by the primary support surface and at least one surface mounted component is supported by the secondary support surface. The flexible coupling tab passes through the at least one coupling passageway to facilitate coupling of a plurality of components of the multilayer substrate with a plurality of components of the at least one surface mounted component via a SMT connector. Primary and secondary lids are secured to opposed sides of the perimeter side wall and forming the hermetically sealed module.