公开(公告)号：US09844169B2

公开(公告)日：2017-12-12

申请号：US14842004

申请日：2015-09-01

申请人： The Johns Hopkins University

发明人： Daniel E. Matlin ,  Sheng Cheng ,  Seppo J. Lehtonen ,  John E. Penn ,  Perry M. Malouf ,  Matthew P. Angert ,  Christopher B. Haskins ,  Avinash Sharma ,  Jacob P. Treadway ,  Robert E. Wallis

IPC分类号： H03C3/02 ,  H05K9/00 ,  H03H11/24

CPC分类号： H05K9/0056 ,  H03C3/02 ,  H03H11/24

摘要： A multi-chip module is provided including a multiplier configured to multiply a frequency of an input signal into a predetermined Ka-band frequency center channel, a modulator configured to modulate the center channel, and an amplifier configured to amplify a modulated signal for output.

公开(公告)号：US20140018018A1

公开(公告)日：2014-01-16

申请号：US14034452

申请日：2013-09-23

申请人： Furukawa Automotive Systems Inc. ,  Furukawa Electric Co., Ltd.

发明人： Daisuke INOUE

IPC分类号： H04B1/40

CPC分类号： H04B1/40 ,  H05K9/0056

摘要： A high-frequency communication device includes a transmitting and receiving circuit board on which a transmitting and receiving circuit that processes a quasi-millimeter-wave and millimeter-wave signal is mounted, and a shield case attached to cover the transmitting and receiving circuit on the transmitting and receiving circuit board. Protrusions and a radio wave absorption sheet are disposed on an inner surface of the shield case opposing the transmitting and receiving circuit board, the protrusions being regularly arranged. The radio wave absorption sheet is disposed in at least one area of the shield case opposing an active component of the transmitting and receiving circuit, the protrusions being disposed in at least one area of the shield case that opposes one of a passive component and a circuit pattern section of the transmitting and receiving circuit. A thickness of the radio wave absorption sheet is smaller than a height of the protrusion.

摘要翻译： 一种高频通信设备包括：发送和接收电路板，其上安装有处理准毫米波和毫米波信号的发送和接收电路;以及屏蔽盒，其附接在所述发送和接收电路上， 发射和接收电路板。 突起和无线电波吸收片设置在与发射和接收电路板相对的屏蔽壳体的内表面上，突起被规则地布置。 无线电波吸收片设置在与发送和接收电路的有源部件相对的屏蔽壳体的至少一个区域中，突起设置在与无源部件和电路中的一个相对的屏蔽壳体的至少一个区域中 发送和接收电路的模式部分。 无线电波吸收片的厚度小于突起的高度。

公开(公告)号：US08395256B2

公开(公告)日：2013-03-12

申请号：US11670952

申请日：2007-02-02

申请人： Ronald D. Boesch ,  Edwin John Nealis ,  Costel Nicolae

发明人： Ronald D. Boesch ,  Edwin John Nealis ,  Costel Nicolae

IPC分类号： H01L23/34

CPC分类号： H05K13/04 ,  H01L2924/0002 ,  H05K9/0056 ,  Y10T29/49146 ,  H01L2924/00

摘要： Microwave or millimeter wave system packaging having a system with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.

摘要翻译： 微波或毫米波系统封装，具有带有底板，过渡板和盖板的系统。 底板包括附在其上的微波或毫米波分量。 过渡板包括附接到其第一侧并且可操作地连接到部件的第一连接器，以及连接到其第二侧并通过板可操作地连接到部件的第二连接器。 盖和底板形成包含板和部件的空腔，并且第二连接器可以可操作地连接到第三连接器，例如设置在空腔外部的印刷电路板和更高级组件。 过渡板还可以包括可操作地连接到组件的第四连接器，用于向外部组件或设备提供信号或从外部组件或设备接收信号。

公开(公告)号：US20110115686A1

公开(公告)日：2011-05-19

申请号：US12620991

申请日：2009-11-18

申请人： Mark HAUHE ,  Clifton Quan ,  Sean Costello ,  Jim Vaught

发明人： Mark HAUHE ,  Clifton Quan ,  Sean Costello ,  Jim Vaught

IPC分类号： H01Q1/52

CPC分类号： H01Q1/422 ,  H01Q15/0006 ,  H01Q15/148 ,  H05K9/0056

摘要： A reconfigurable fluidic shutter for selectively shielding an antenna array includes a first surface and second surface spaced apart and defining a cavity; and a pump configured to pump liquid that attenuates electromagnetic radiation, such as a liquefied metal or alloy composition, into and out of the cavity. The first and second surface are transparent to electromagnetic radiation, for instance, microwave or other RF radiation.

摘要翻译： 用于选择性地屏蔽天线阵列的可重构流体快门包括间隔开并限定空腔的第一表面和第二表面; 以及构造成泵送液体的泵，其将诸如液化金属或合金组合物的电磁辐射衰减到腔中。 第一和第二表面对电磁辐射是透明的，例如微波或其它射频辐射。

公开(公告)号：US07768764B2

公开(公告)日：2010-08-03

申请号：US11428916

申请日：2006-07-06

申请人： Marc H. Popek

发明人： Marc H. Popek

IPC分类号： H05F3/04

CPC分类号： H05K9/0056 ,  A61N1/14

摘要： Electrostatic discharge protection for guided wave microwave structures is provided by a protection device that imposes minimal disruption on the microwave structures and negligible interference with the normal operation of the structures. The protection device provides a discharge path between a signal conductor and a ground conductor when electrostatic charges on the signal conductor reach a predetermined voltage level. The protection device includes an insulating base that bridges a space between the signal conductor and the ground conductor and that supports a dispersion of metal particles adhered to the base.

摘要翻译： 用于导波微波结构的静电放电保护由保护装置提供，其对微波结构施加最小的破坏，并且对结构的正常操作可以忽略不计。 当信号导体上的静电电荷达到预定电压电平时，保护装置提供信号导体和接地导体之间的放电路径。 保护装置包括绝缘基座，其桥接信号导体和接地导体之间的空间，并且支撑附着在基座上的金属颗粒的分散体。

公开(公告)号：US20080129638A1

公开(公告)日：2008-06-05

申请号：US11874193

申请日：2007-10-17

申请人： Ching-Long ONG

发明人： Ching-Long ONG

IPC分类号： H01Q1/40

CPC分类号： H01Q1/40 ,  H05K9/0056

摘要： A composite structure for an antenna and a shell, wherein the antenna mode is pre-set on the surface of the shell of the computer or the electric appliances before the shell is formed. The main layers are preimpregnated with resin and then are subjected to integral forming process, so that the antenna is laminated on shell to improve the stability of the whole structure. Further, on the shell surface can be disposed a plurality of antenna modes. And since the shell is a main layer which naturally can acts as a conductive shield to improve the function and efficiency of the antenna mode.

摘要翻译： 一种用于天线和壳体的复合结构，其中天线模式预先设置在计算机的外壳的表面上，或者在形成外壳之前的电器。 主层用树脂预浸渍，然后进行整体成型处理，使天线层压在壳体上，以提高整个结构的稳定性。 此外，在壳体表面上可以设置多种天线模式。 并且由于外壳是主层，其自然可以用作导电屏蔽，以改善天线模式的功能和效率。

公开(公告)号：US20060034063A1

公开(公告)日：2006-02-16

申请号：US10533723

申请日：2003-10-20

申请人： Kam Kwong ,  Ee Lu

发明人： Kam Kwong ,  Ee Lu

IPC分类号： H05K5/04

CPC分类号： H05K9/0056

摘要： A high-frequency device comprises a frame (2) provided with walls (12; 9-11) and leg sections (13; 16) extending from said walls. Said device further comprises a printed circuit board (3) extending perpendicularly to said walls, wherein said leg sections extend through holes (14; 19) in said printed circuit board and are connected to the printed circuit board by means of solder. At least one outer side wall of said frame is provided with at least one leg section which extends through a hole located in a part of said printed circuit board, which part extends through said outer side wall.

摘要翻译： 高频装置包括设置有从所述壁延伸的壁（12; 9-11）和腿部段（13; 16）的框架（2）。 所述装置还包括垂直于所述壁延伸的印刷电路板（3），其中所述脚部分延伸穿过所述印刷电路板中的孔（14; 19），并通过焊料连接到印刷电路板。 所述框架的至少一个外侧壁设置有至少一个支腿部分，所述腿部部分延伸穿过位于所述印刷电路板的一部分中的孔，该部分延伸穿过所述外侧壁。

公开(公告)号：US20050078468A1

公开(公告)日：2005-04-14

申请号：US10682651

申请日：2003-10-09

申请人： WIlliam DiPoala

发明人： WIlliam DiPoala

IPC分类号： H05K9/00

CPC分类号： H05K9/0056

摘要： A shielding assembly and method for use with an electromagnetic field generating source. The assembly includes an outer housing that includes a conductive material. The outer housing defines a chamber in which the field generating source is located. A polymeric inner body substantially fills the chamber. The inner body is spaced from and circumscribes the field generating source. The field generating source may be the resonant oscillator of a microwave transceiver circuit and the inner body may advantageously include between 2-10%, by weight, of a semiconductive filler such as carbon or graphite. A printed circuit board may be attached to the outer housing to define the chamber together with the outer housing. The inner body may be secured within the chamber by compressive engagement between the printed circuit board and outer housing. Spacing elements are used to provide a clearance gap between the printed circuit board and the inner body.

摘要翻译： 一种用于电磁场产生源的屏蔽组件和方法。 组件包括包括导电材料的外壳。 外部壳体限定了场发生源所在的腔室。 聚合物内体基本上填充该室。 内部主体与场发生源间隔开并围绕场发生源。 场产生源可以是微波收发器电路的谐振振荡器，并且内主体可以有利地包括2-10重量％的半导体填料例如碳或石墨。 印刷电路板可以附接到外壳以与外壳一起限定室。 内部主体可以通过印刷电路板和外部壳体之间的压缩接合来固定在腔室内。 间距元件用于在印刷电路板和内部主体之间提供间隙。

公开(公告)号：US5986208A

公开(公告)日：1999-11-16

申请号：US6696

申请日：1998-01-14

申请人： Edward A. Taylor ,  Marshall Neal Hulbert

发明人： Edward A. Taylor ,  Marshall Neal Hulbert

IPC分类号： H01P1/08 ,  H05K9/00 ,  H05K5/06

CPC分类号： H05K9/0056 ,  H01P1/08

摘要： A microwave electronics package has a microwave waveguide window assembly hermetically sealed to the electronics package using an intermediate bimetallic bushing. The metallic components of the bimetallic bushing have thermal properties similar to the thermal properties of the housing and waveguide window frame, respectively, permitting the use of fusion welding techniques such as laser welding to hermetically seal the waveguide assembly in the housing and to preserve the integrity of the waveguide window during fusion welding and during thermal cycling of the electronics package. A microwave grounding element is also provided in the assembled electronics package to provide a continuous microwave ground path.

摘要翻译： 微波电子封装具有使用中间双金属衬套气密密封到电子封装的微波波导窗组件。 双金属衬套的金属部件分别具有类似于壳体和波导窗框的热性质的热性质，允许使用诸如激光焊接的熔焊技术将波导组件气密地密封在壳体中并保持完整性 在熔融焊接期间和在电子封装的热循环期间的波导窗口。 在组装的电子封装中还提供微波接地元件以提供连续的微波接地路径。

公开(公告)号：US10027018B2

公开(公告)日：2018-07-17

申请号：US15360647

申请日：2016-11-23

申请人： Keyssa, Inc.

发明人： Gary D. McCormack ,  Ian A. Kyles

IPC分类号： H04B7/00 ,  H01Q1/22 ,  H04B1/18 ,  H04B5/00 ,  H05K1/14 ,  H01L23/48 ,  H01L23/66 ,  H01Q7/00 ,  H01Q9/26 ,  H01Q23/00 ,  H05K9/00 ,  H05K1/02 ,  H01L23/495 ,  H01L23/552 ,  H04B1/40 ,  H01Q1/38 ,  H01Q9/04 ,  H01L23/00 ,  H05K1/18

CPC分类号： H01Q1/2291 ,  H01L23/48 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/207 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/0485 ,  H01Q9/265 ,  H01Q23/00 ,  H04B1/18 ,  H04B1/40 ,  H04B5/0031 ,  H04B5/0037 ,  H05K1/0243 ,  H05K1/144 ,  H05K1/181 ,  H05K9/0056 ,  H05K2201/0723 ,  H05K2201/10522 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.