公开(公告)号：US10348302B1

公开(公告)日：2019-07-09

申请号：US15994671

申请日：2018-05-31

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Jason F. Ross ,  Jamie A. Bernard ,  John T. Matta

IPC: H03K19/003 ,  H03K19/007 ,  H01L23/556 ,  H03K19/20

Abstract: A radiation-hardened electronic system is disclosed. The radiation-hardened electronic system includes a reconfigurable analog circuit block, a digital configuration logic circuit block, and a radiation-hardened isolation latch circuit connecting between the reconfigurable analog circuit block and the digital configuration logic circuit block. The reconfigurable analog circuit block includes multiple analog inputs and outputs. The digital configuration logic circuit block includes multiple digital inputs and outputs for controlling various functionalities of the reconfigurable analog circuit block via a set of configuration data. The radiation-hardened isolation latch circuit prevents the configuration data from entering the reconfigurable analog circuit block when the configuration data has been corrupted by a SEU.

公开(公告)号：US20200051961A1

公开(公告)日：2020-02-13

申请号：US16057204

申请日：2018-08-07

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Dale A. Rickard ,  Jason F. Ross ,  John T. Matta ,  Richard J. Ferguson ,  Alan F. Dennis ,  Joseph R. Marshall, JR. ,  Daniel L. Stanley

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/00 ,  H01L27/112 ,  H01L25/00

Abstract: An MCM-HIC device flexibly adds enhanced features to a VLSI “core” IC that are not directly supported by the core IC, such as unsupported communication protocols and/or support of cold spare operation. The core IC is mounted on an interconnecting substrate together with at least one “chiplet” that provides the required feature(s). The chiplet can be programmable. The chiplet can straddle a boundary of an interposer region of the substrate that provides higher density interconnections at lower currents. The disclosed method can include selecting a core IC and at least one active, passive, or “mixed” chiplet, configuring a substrate, and installing the core IC and chiplet(s) on the substrate. In embodiments, the core IC and/or chiplet(s) can be modified before assembly to obtain the desired result. Cost can be reduced by pre-designing and, in embodiments, pre-manufacturing the chiplets and modified core ICs in cost-effective quantities.