公开(公告)号：US20200051961A1

公开(公告)日：2020-02-13

申请号：US16057204

申请日：2018-08-07

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Dale A. Rickard ,  Jason F. Ross ,  John T. Matta ,  Richard J. Ferguson ,  Alan F. Dennis ,  Joseph R. Marshall, JR. ,  Daniel L. Stanley

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/00 ,  H01L27/112 ,  H01L25/00

Abstract: An MCM-HIC device flexibly adds enhanced features to a VLSI “core” IC that are not directly supported by the core IC, such as unsupported communication protocols and/or support of cold spare operation. The core IC is mounted on an interconnecting substrate together with at least one “chiplet” that provides the required feature(s). The chiplet can be programmable. The chiplet can straddle a boundary of an interposer region of the substrate that provides higher density interconnections at lower currents. The disclosed method can include selecting a core IC and at least one active, passive, or “mixed” chiplet, configuring a substrate, and installing the core IC and chiplet(s) on the substrate. In embodiments, the core IC and/or chiplet(s) can be modified before assembly to obtain the desired result. Cost can be reduced by pre-designing and, in embodiments, pre-manufacturing the chiplets and modified core ICs in cost-effective quantities.

公开(公告)号：US20200373286A1

公开(公告)日：2020-11-26

申请号：US16422072

申请日：2019-05-24

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Lori D. Dennis ,  Jamie A. Bernard ,  Alan F. Dennis ,  Jane O. Gilliam ,  Jason F. Ross ,  Keith K. Sturcken ,  Dale A Rickard

IPC: H01L25/16 ,  H01L23/538 ,  H01L23/00 ,  H01L23/64 ,  H01L25/00 ,  H01L23/498 ,  H01L23/367

Abstract: A multi-chip module hybrid integrated circuit (MCM-HIC) provides cold spare support to an apparatus comprising a plurality of ICs and/or other circuits that are not cold spare compliant. At least one core IC and at least one cold spare chiplet are installed on an interconnecting substrate having a plurality of power zones to which power can be applied and withdrawn as needed. When powered, the cold spare chiplets serve as mediators and interfaces between the non cold spare compliant circuits. When the cold spare chiplets are at least partly unpowered, they protect all interconnected circuits, and ensure that interconnected circuits that remain powered are not hindered by unpowered interconnected circuits. Cold spare chiplets can extend across boundaries between power zones. External circuits can be exclusively interfaced to a subset of the power zones. Separate power circuits within a power zone can be sequenced during application and withdrawal of power.

公开(公告)号：US10854586B1

公开(公告)日：2020-12-01

申请号：US16422072

申请日：2019-05-24

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Lori D. Dennis ,  Jamie A. Bernard ,  Alan F. Dennis ,  Jane O. Gilliam ,  Jason F. Ross ,  Keith K. Sturcken ,  Dale A Rickard

IPC: G06N20/00 ,  G06F11/07 ,  H01L25/16 ,  H01L23/538 ,  H01L23/00 ,  H01L23/64 ,  H01L25/00 ,  H01L23/498 ,  H01L23/367

Abstract: A multi-chip module hybrid integrated circuit (MCM-HIC) provides cold spare support to an apparatus comprising a plurality of ICs and/or other circuits that are not cold spare compliant. At least one core IC and at least one cold spare chiplet are installed on an interconnecting substrate having a plurality of power zones to which power can be applied and withdrawn as needed. When powered, the cold spare chiplets serve as mediators and interfaces between the non cold spare compliant circuits. When the cold spare chiplets are at least partly unpowered, they protect all interconnected circuits, and ensure that interconnected circuits that remain powered are not hindered by unpowered interconnected circuits. Cold spare chiplets can extend across boundaries between power zones. External circuits can be exclusively interfaced to a subset of the power zones. Separate power circuits within a power zone can be sequenced during application and withdrawal of power.