公开(公告)号：US20190311881A1

公开(公告)日：2019-10-10

申请号：US15949166

申请日：2018-04-10

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Eugene M. Lavely ,  Adam J. Marcinuk ,  Amrita V. Masurkar ,  Paul R. Moffitt ,  Michael S. Richman ,  Jonathan R. Takahashi ,  Jonathan K. Tong ,  Chris L. Willis

IPC: H01J37/244 ,  H01J37/20 ,  H01J37/28 ,  H01J37/22

Abstract: A system and method for imaging a sample having a complex structure (such as an integrated circuit) implements two modes of operation utilizing a common electron beam generator that produces an electron beam within a chamber. In the first mode, the electron beam interacts directly with the sample, and backscattered electrons, secondary electrons, and backward propagating fluorescent X-rays are measured. In the second mode, the electron beam interrogates the sample via X-rays generated by the electron beam within a target that is positioned between the electron beam generator and the sample. Transmitted X-rays are measured by a detector within the vacuum chamber. The sample is placed on a movable platform to precisely position the sample with respect to the electron beam. Interferometric and/or capacitive sensors are used to measure the position of the sample and movable platform to provide high accuracy metadata for performing high resolution three-dimensional sample reconstruction.

公开(公告)号：US10468230B2

公开(公告)日：2019-11-05

申请号：US15949166

申请日：2018-04-10

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Eugene M. Lavely ,  Adam J. Marcinuk ,  Amrita V. Masurkar ,  Paul R. Moffitt ,  Michael S. Richman ,  Jonathan R. Takahashi ,  Jonathan K. Tong ,  Chris L. Willis

IPC: H01H37/28 ,  G01N23/22 ,  G21K7/00 ,  H01J37/244 ,  H01J37/28 ,  H01J37/22 ,  H01J37/20

Abstract: A system and method for imaging a sample having a complex structure (such as an integrated circuit) implements two modes of operation utilizing a common electron beam generator that produces an electron beam within a chamber. In the first mode, the electron beam interacts directly with the sample, and backscattered electrons, secondary electrons, and backward propagating fluorescent X-rays are measured. In the second mode, the electron beam interrogates the sample via X-rays generated by the electron beam within a target that is positioned between the electron beam generator and the sample. Transmitted X-rays are measured by a detector within the vacuum chamber. The sample is placed on a movable platform to precisely position the sample with respect to the electron beam. Interferometric and/or capacitive sensors are used to measure the position of the sample and movable platform to provide high accuracy metadata for performing high resolution three-dimensional sample reconstruction.