公开(公告)号：US20140242743A1

公开(公告)日：2014-08-28

申请号：US14271574

申请日：2014-05-07

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Thomas H. Wallace

IPC: H01L31/0232 ,  H01L31/18

CPC classification number: H01L31/02327 ,  G01J3/04 ,  G01J3/2803 ,  G01J3/2823 ,  G02B5/005 ,  H01L27/14625 ,  H01L31/18

Abstract: An entry slit panel for a push-broom hyperspectral camera is formed at least partly from a silicon wafer on which at least one companion sensor is fabricated, whereby the companion sensor is co-planar with the slit and detects light imaged on the panel but not on the slit. In embodiments, the companion sensor is a panchromatic sensor or a sensor that detects light outside the wavelength range of the camera. At least a region of the wafer is back-thinned to a thickness appropriate for a diffraction slit. The slit can be etched or laser cut through the thinned region, or formed between the wafer and another wafer or a conventional blade. The wafer can be back-coated or metalized to ensure its opacity across the camera's wavelength range. The companion sensor can be located relative to the slit to detect scene features immediately before or after the hyperspectral camera.

Abstract translation: 至少部分地由至少一个配套传感器制造的硅晶片形成用于推扫式超光谱照相机的入口狭缝板，由此配对传感器与狭缝共面并检测在面板上成像的光，但不是 在狭缝上。 在实施例中，伴随传感器是全色传感器或检测相机波长范围外的光的传感器。 将晶片的至少一个区域反薄至适于衍射狭缝的厚度。 狭缝可以被蚀刻或激光切割穿过薄化区域，或者形成在晶片和另一晶片或常规刀片之间。 晶片可以背涂或金属化，以确保其在相机的波长范围内的不透明度。 伴随传感器可以相对于狭缝定位，以便在高光谱相机之前或之后立即检测场景特征。

公开(公告)号：US08865496B2

公开(公告)日：2014-10-21

申请号：US14271574

申请日：2014-05-07

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Thomas H. Wallace

IPC: H01L21/00 ,  H01L31/18 ,  H01L31/0232

CPC classification number: H01L31/02327 ,  G01J3/04 ,  G01J3/2803 ,  G01J3/2823 ,  G02B5/005 ,  H01L27/14625 ,  H01L31/18

Abstract: A method for fabricating an image panel for a hyperspectral camera that is configured to scan a scene and obtain spectral image data over as defined range of wavelengths. At least one companion sensor is first fabricated on a planar imaging surface of a silicon die. At least as region of the silicon die is then back thinned to a diffraction thickness that is suitable for a diffraction slit. A diffraction slit is then formed in the thinned region so that the diffraction slit penetrates the silicon die in the thinned region, and the diffraction slit is co-planar with the imaging surface of the silicon die.

Abstract translation: 一种用于制造用于超光谱照相机的图像面板的方法，其被配置为扫描场景并且以规定的波长范围获得光谱图像数据。 首先在硅片的平面成像表面上制造至少一个伴随传感器。 至少当硅晶片的区域然后被背薄化到适合于衍射狭缝的衍射厚度。 然后在减薄区域中形成衍射狭缝，使得衍射狭缝穿透薄化区域中的硅模头，并且衍射狭缝与硅模具的成像表面共面。