公开(公告)号：US09952137B2

公开(公告)日：2018-04-24

申请号：US15103068

申请日：2014-11-20

Applicant: BAE Systems plc

Inventor： Mark David Balmond ,  Alexander Roy Parfitt ,  Gary David Panaghiston ,  Larry Brian Tween ,  Christopher Colin Figgures

IPC: G01N17/04 ,  B29C45/14 ,  B29C45/16 ,  B29C45/34 ,  B64D45/00 ,  G01N27/04 ,  B29K79/00 ,  B29K305/02 ,  B29L31/34

CPC classification number: G01N17/04 ,  B29C45/14655 ,  B29C45/14836 ,  B29C45/1671 ,  B29C45/34 ,  B29C2045/14844 ,  B29C2791/006 ,  B29K2079/08 ,  B29K2305/02 ,  B29L2031/3481 ,  B64D45/00 ,  B64D2045/0085 ,  G01N27/041 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A sensor (1) and a method of manufacturing the sensor (1), the sensor (1) including a number of metallic strips (5,6,7) mounted on a non-conducting substrate (4) and a module (3) for forming electrical connections to the strips (5,6,7) whereby to enable communication between the strips (5,6,7) and monitoring equipment for the sensor (4), the module including a number of wire connections (16), the method including the steps of encapsulating the wire connections within a flexible chemical and heat resistant sealing compound, and subsequently, encapsulating the flexible sealing compound within a second sealing compound (34) by an injection molding process.

公开(公告)号：US20160313232A1

公开(公告)日：2016-10-27

申请号：US15103068

申请日：2014-11-20

Applicant: BAE SYSTEMS PLC

Inventor： Mark David Balmond ,  Alexander Roy Parfitt ,  Gary David Panaghiston ,  Larry Brian Tween ,  Christopher Colin Figgures

IPC: G01N17/04 ,  B64D45/00 ,  B29C45/34 ,  G01N27/04 ,  B29C45/14 ,  B29C45/16

CPC classification number: G01N17/04 ,  B29C45/14655 ,  B29C45/14836 ,  B29C45/1671 ,  B29C45/34 ,  B29C2045/14844 ,  B29C2791/006 ,  B29K2079/08 ,  B29K2305/02 ,  B29L2031/3481 ,  B64D45/00 ,  B64D2045/0085 ,  G01N27/041 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A sensor (1) and a method of manufacturing the sensor (1), the sensor (1) including a number of metallic strips (5,6,7) mounted on a non-conducting substrate (4) and a module (3) for forming electrical connections to the strips (5,6,7) whereby to enable communication between the strips (5,6,7) and monitoring equipment for the sensor (4), the module including a number of wire connections (16), the method including the steps of encapsulating the wire connections within a flexible chemical and heat resistant sealing compound, and subsequently, encapsulating the flexible sealing compound within a second sealing compound (34) by an injection moulding process.

Abstract translation: 一种传感器（1）和制造传感器（1）的方法，所述传感器（1）包括安装在非导电衬底（4）和模块（3）上的多个金属条（5,6,7） 用于形成到所述条带（5,6,7）的电连接，由此能够使所述条带（5,6,7）和所述传感器（4）的监控设备之间的通信，所述模块包括多个电线连接（16）， 该方法包括以下步骤：将电线连接件封装在柔性化学和耐热密封化合物内，随后通过注射成型工艺将柔性密封化合物封装在第二密封化合物（34）内。