公开(公告)号：US20170121452A1

公开(公告)日：2017-05-04

申请号：US15342759

申请日：2016-11-03

Applicant: BASF SE

Inventor： Matthaeus KOPCZYNSKI ,  Michael HENNINGSEN ,  Miran YU

IPC: C08G59/68 ,  C08G59/50 ,  B29C35/02 ,  C08J5/24 ,  C08J5/04 ,  B29B15/12 ,  C08K7/14 ,  C08G59/24

CPC classification number: C08G59/686 ,  B29B15/12 ,  B29C35/02 ,  B29C70/32 ,  B29K2063/00 ,  C08G59/245 ,  C08G59/5033 ,  C08G2390/00 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/02 ,  C08K7/14 ,  C08K9/08

Abstract: The invention is directed to a curable composition, which comprises an epoxy resin mixture, wherein the epoxy resin mixture comprises a) an epoxy resin; b) diethyl methyl benzene diamine (DETDA) as hardener; c) at least one compound selected from the group consisting of 1,8-diazabicyclo[5.4.0]undec-7-ene (DBU) and 1,5-diazabicyclo[4.3.0]non-5-ene (DBN) as catalyst.

公开(公告)号：US20210102026A1

公开(公告)日：2021-04-08

申请号：US16627505

申请日：2018-07-13

Applicant: BASF SE

Inventor： Matthaeus KOPCZYNSKI ,  Alexander PANCHENKO ,  Irene GORMAN ,  Michael HENNINGSEN

IPC: C08G59/50 ,  C08G59/56 ,  C07C211/36

Abstract: Secondary diamine N,N′-dialkyl methylcyclohexanediamine acts as a reactive diluent for curable epoxy resin compositions. The addition of this compounds significantly reduces the initial viscosity of the epoxy resin composition while the resulting cured epoxy resin exhibits comparable favorable mechanical, chemical resistance and thermal properties such as low water uptake and high glass transition temperatures. Such compositions are particular suitable for manufacturing of composites with high mechanical and heat resistance properties by the means of resin transfer molding (RTM), vacuum aided resin transfer molding (VARTM) or infusion technology.