公开(公告)号：US12122958B2

公开(公告)日：2024-10-22

申请号：US18114759

申请日：2023-02-27

申请人： Saudi Arabian Oil Company

发明人： Vikrant Wagle ,  Noktan Mohammed AlYami ,  Abdullah Saleh Hussain Al-Yami ,  Khawlah Alanqari

IPC分类号： C09K8/518 ,  C08G59/24 ,  C08G59/50 ,  C08J9/08 ,  C09K8/508 ,  E21B21/00

CPC分类号： C09K8/518 ,  C08G59/245 ,  C08G59/5006 ,  C08J9/08 ,  C09K8/5086 ,  E21B21/003 ,  C08J2203/02 ,  C08J2363/02

摘要： A method for mitigating loss circulation zones in a wellbore is provided. The method includes synthesizing a carbamate from an amine-curing agent, and the carbamate is mixed with an epoxy resin from the loss control composition. The loss control composition is pumped into a wellbore with a loss circulation zone, wherein the loss control composition flows into the loss circulation zone. The carbamate of the loss control composition is allowed to decompose at wellbore temperatures, wherein the carbamate releases CO2 gas and the amine-curing agent. The CO2 gas foams the epoxy resin, expanding the epoxy resin to fill voids in the loss circulation zone, and the amine-curing agent cures the foamed epoxy resin, forming a loss control material that seals the loss circulation zone.

公开(公告)号：US20240336751A1

公开(公告)日：2024-10-10

申请号：US18681678

申请日：2022-07-27

申请人： Teijin Limited

发明人： Kohei OSAKI ,  Suguru OZAWA ,  Toru KANEKO

IPC分类号： C08J5/04 ,  C08G59/24 ,  C08G59/28 ,  C08G59/32 ,  C08G59/38 ,  C08G59/50 ,  C08J5/24

CPC分类号： C08J5/042 ,  C08G59/245 ,  C08G59/28 ,  C08G59/3218 ,  C08G59/3227 ,  C08G59/38 ,  C08G59/5033 ,  C08J5/243 ,  C08J2363/00

摘要： A fiber-reinforced composite material contains a resin cured product obtained by curing an epoxy resin composition containing a curing agent A, a curing agent B, a curing agent C, an epoxy resin D, an epoxy resin E, and resin particles F, and a stitched reinforcing fiber base material. The fiber-reinforced composite material enables a fiber-reinforced composite material to be provided that achieves high productivity, and exhibits heat resistance and mechanical properties while using an epoxy resin composition that has low viscosity, a long pot life, and fast curability.

公开(公告)号：US20240327582A1

公开(公告)日：2024-10-03

申请号：US18744355

申请日：2024-06-14

申请人： Polynt Composites Norway AS

发明人： Lionel Gehringer ,  Miran Yu ,  Michael Henningsen ,  Joachim Zwecker

IPC分类号： C08J5/04 ,  C08G59/24 ,  C08G59/50 ,  C08J5/24

CPC分类号： C08J5/043 ,  C08G59/245 ,  C08G59/5006 ,  C08G59/5073 ,  C08J5/244 ,  C08J5/249 ,  C08J2363/02

摘要： The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener component comprising at least one aminoalkylimidazole compound, at least one diazabicycloalkylen compound and at least one latent hardener. In said epoxy-resin composition, the amount of the aminoalkylimidazole compounds used is in the range from 0.007 to 0.025 mol per mole of epoxy groups of the entire composition. The invention also relates to a fiber-matrix-semifinished-product composition (SMC composition or BMC composition) with, as matrix component, the epoxy-resin composition mentioned, and with, suspended therein, short reinforcement fibers with an average length of from 0.3 to 5.0 cm. The invention also relates to the corresponding semisolid fiber-matrix composite, in particular to the semisolid SMC and to the corresponding cured fiber-matrix semifinished product, in particular the cured SMC.

公开(公告)号：US12104009B2

公开(公告)日：2024-10-01

申请号：US16971307

申请日：2018-02-22

申请人： RESONAC CORPORATION

发明人： Kazumasa Fukuda ,  Yoshitaka Takezawa ,  Tomoko Higashiuchi ,  Naoki Maruyama ,  Shingo Tanaka

IPC分类号： C08G59/24 ,  C08G59/22 ,  C08G59/28 ,  C08J5/04 ,  C08K5/00 ,  C08L63/00 ,  C08L63/02

CPC分类号： C08G59/226 ,  C08G59/245 ,  C08G59/28 ,  C08J5/04 ,  C08K5/0025 ,  C08G2250/00

摘要： (1) An epoxy resin, which is configured to form, in a cured product of the epoxy resin, a phase-separated structure that is formed from at least two phases, wherein at least one phase of the at least two phases includes a liquid crystal structure and (2) An epoxy resin, which is configured to form a phase-separated structure in a cured product, the cured product being obtained by curing the epoxy resin by increasing a temperature of the epoxy resin from an ambient temperature to a curing temperature at a rate of not greater than 20° C./minute.

公开(公告)号：US12098306B2

公开(公告)日：2024-09-24

申请号：US17262431

申请日：2019-07-25

申请人： LG Chem, Ltd.

发明人： Min Jin Ko ,  Jae Ho Jung ,  Min A Yu ,  Min Kyoun Kim ,  Byung Kyu Cho ,  Taek Yong Lee ,  Dong Yong Kim

IPC分类号： C09J163/00 ,  B32B27/38 ,  B32B27/40 ,  C08F212/08 ,  C08F220/14 ,  C08F236/06 ,  C08G18/10 ,  C08G18/24 ,  C08G18/48 ,  C08G18/67 ,  C08G18/75 ,  C08G59/24 ,  C08G59/40 ,  C08L51/04 ,  C09J11/08 ,  C09J151/04 ,  C09J163/04 ,  C09J175/08

CPC分类号： C09J163/04 ,  C08F212/08 ,  C08F220/14 ,  C08F236/06 ,  C08G18/10 ,  C08G18/24 ,  C08G18/4825 ,  C08G18/6715 ,  C08G18/755 ,  C08G59/245 ,  C08G59/4021 ,  C08L51/04 ,  C09J11/08 ,  C09J151/04 ,  C09J175/08 ,  C08L2201/08 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2205/18 ,  C08L2207/53 ,  C09J2301/30 ,  C09J2301/414 ,  C09J2451/00 ,  C09J2463/00 ,  C09J2475/00

摘要： An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

公开(公告)号：US12098256B2

公开(公告)日：2024-09-24

申请号：US18323068

申请日：2023-05-24

申请人： CHANG CHUN PLASTICS CO., LTD.

发明人： Hsuan-Min Lin ,  Chih-Fu Chen ,  An-Pang Tu

IPC分类号： C08J5/18 ,  B32B15/092 ,  B32B15/20 ,  C08G59/24 ,  C08G73/00 ,  C08K3/04 ,  C08K3/36 ,  C08K7/18

CPC分类号： C08J5/18 ,  B32B15/092 ,  B32B15/20 ,  C08G59/245 ,  C08G73/00 ,  C08K3/04 ,  C08K3/36 ,  C08K7/18 ,  B32B2307/732 ,  B32B2311/12 ,  B32B2457/08 ,  C08J2363/00

摘要： A resin film is provided. When the resin film is characterized by Fourier transform infrared spectroscopy (FTIR), the Fourier transform infrared spectrum of the resin film has a signal intensity A from 2205 cm−1 to 2322 cm−1 and a signal intensity B from 1472 cm−1 to 1523 cm−1, and 0.70≤A/B≤1.95.

公开(公告)号：US12091495B2

公开(公告)日：2024-09-17

申请号：US17992971

申请日：2022-11-23

申请人： Huntsman Petrochemical LLC

发明人： Wei-Yang Su ,  Hui Zhou

IPC分类号： C08G59/56 ,  C08G59/24 ,  C08G59/50 ,  C08G59/62

CPC分类号： C08G59/56 ,  C08G59/245 ,  C08G59/5026 ,  C08G59/504 ,  C08G59/5046 ,  C08G59/62

摘要： A curing agent comprising a polyetheramine, a tertiary amine substantially free of an aromatic tertiary amine and glycerin. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.

公开(公告)号：US20240294701A1

公开(公告)日：2024-09-05

申请号：US18115625

申请日：2023-02-28

申请人： Westlake Epoxy Inc.

发明人： Mark KAPELLEN

IPC分类号： C08G59/24 ,  C08G59/02 ,  C08G59/08 ,  C08G59/68

CPC分类号： C08G59/245 ,  C08G59/022 ,  C08G59/08 ,  C08G59/68

摘要： Embodiments of the present disclosure generally relate to processes for forming bisphenols and epoxy resin compositions. In an embodiment, a process for making an epoxy resin composition is provided. The process includes reacting a mixture comprising a catalyst, a monophenol, and an aldehyde or ketone, the mixture comprising a stoichiometric excess of the aldehyde or ketone to the monophenol, and forming a reaction product with the reaction mixture, the reaction product comprising a bisphenol. The process further includes removing water and unreacted aldehyde or ketone from the reaction product, and converting the reaction product comprising the bisphenol to an epoxy resin composition, wherein, after reacting the mixture and before converting the reaction product, the process is free of washing, drying, solid-liquid separation, or combinations thereof.

公开(公告)号：US20240263004A1

公开(公告)日：2024-08-08

申请号：US18631187

申请日：2024-04-10

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Shoichi OSADA ,  Norifumi KAWAMURA ,  Hiroki HORIGOME ,  Kenji HAGIWARA ,  Ryuhei YOKOTA

IPC分类号： C08L63/04 ,  C08G59/24 ,  C08K3/36 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29

CPC分类号： C08L63/04 ,  C08G59/245 ,  C08K3/36 ,  H01L21/56 ,  H01L23/295 ,  H01L24/16 ,  C08L2203/206 ,  H01L2224/05105 ,  H01L2224/05193 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/0543 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/186

摘要： Provided are a resin composition for encapsulation that is superior in high-temperature reverse bias test (HTRB test) reliability; and a semiconductor device. The resin composition for encapsulation is used to encapsulate a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond, and a cured product of the resin composition for encapsulation has a dielectric tangent of not larger than 0.50 when measured at 150° C. and 0.1 Hz. The semiconductor device is such that a power semiconductor element made of Si, SiC, GaN, Ga2O3 or diamond is encapsulated by the cured product of the resin composition for encapsulation.

公开(公告)号：US20240247105A1

公开(公告)日：2024-07-25

申请号：US18624456

申请日：2024-04-02

申请人： THE BOEING COMPANY

发明人： Vijaykumar IJERI ,  Stephen P. GAYDOS ,  Patrick J. KINLEN

IPC分类号： C08G73/02 ,  C08G59/24 ,  C08G59/44 ,  C08G59/50 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  C08K5/098 ,  C08K5/3437 ,  C08K5/3472 ,  C08K5/378 ,  C08K5/42 ,  C08K5/47 ,  C09D5/24

CPC分类号： C08G73/0266 ,  C08G59/245 ,  C08G59/44 ,  C08G59/50 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  C08K5/098 ,  C08K5/3437 ,  C08K5/3472 ,  C08K5/378 ,  C08K5/42 ,  C08K5/47 ,  C08G2150/00 ,  C08K2003/2241 ,  C08K2003/329 ,  C09D5/24

摘要： The present disclosure provides compositions, articles thereof, and methods of forming compositions. In at least one aspect, a composition includes (1) an epoxy, (2) an amino or amido hardener, (3) a polyaniline, (4) a dopant selected from a triazolyl, a thiazolyl, a quinolinyl, a salicylate, a benzoate, a glycolate, a phosphate, a sulfonate, an oxalate, or combination(s) thereof; and (5) a pigment selected from titanium dioxide, silica, talc, mica, aluminium stearate, or combination(s) thereof. The polyaniline+dopant comprises greater than 6 wt %, by weight of the composition. In at least one aspect, a method includes introducing an acid form of a polyaniline to a hydroxide to form a polyaniline hydroxide. The method includes introducing a dopant to the polyaniline hydroxide to form a doped polyaniline.