THERMALLY CONDUCTIVE POLYESTER MOLDING MATERIALS
    1.
    发明申请
    THERMALLY CONDUCTIVE POLYESTER MOLDING MATERIALS 审中-公开
    导热聚酯模塑材料

    公开(公告)号:US20130270477A1

    公开(公告)日:2013-10-17

    申请号:US13913924

    申请日:2013-06-10

    Applicant: BASF SE*

    Abstract: Thermoplastic molding compositions comprisingA) from 10 to 69% by weight of a thermoplastic polyester B) from 30 to 79% by weight of an aluminum oxide C) from 0.01 to 10% by weight of an organic or inorganic acid or mixture of these D) from 0 to 10% by weight of D1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, part 2), or D2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, or a mixture of these E) from 0 to 50% by weight of other additives, where the entirety of the percentages by weight of components A) to E) gives 100%.

    Abstract translation: 热塑性成型组合物,其包含A)10至69重量%的热塑性聚酯B)30至79重量%的氧化铝C)0.01至10重量%的有机或无机酸或这些D的混合物 )0至10重量%的D1)至少一种高度支化或超支化的聚碳酸酯,其OH数为1至600mg KOH / g聚碳酸酯(根据DIN 53240,第2部分)或D2)至少一种高度 支链或超支化的AxBy型聚酯,其中x为至少1.1,y为至少2.1,或这些E)的混合物为0至50重量%的其它添加剂,其中组分A的重量百分比 )到E)给出100%。

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