公开(公告)号：US20240258337A1

公开(公告)日：2024-08-01

申请号：US18016471

申请日：2022-03-31

申请人： BEIJING BOE TECHNOLOGY GROUP CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Jinchao BAI ,  Bo LIU ,  Xiangqian DING ,  Hui GUO ,  Yihe JIA ,  Yanxin JI ,  Yue LIU

IPC分类号： H01L27/12 ,  G02F1/1362

CPC分类号： H01L27/1244 ,  G02F1/136295 ,  H01L27/1259

摘要： An array substrate includes a base substrate, a driving circuit layer with a first pillow body on a peripheral region of the array substrate, an organic thin film layer and a conductive layer sequentially stacked; the first pillow body includes a first pillow metal block located on at least one of a source drain metal layer and a gate layer and a first pillow insulating layer covering the first pillow metal block; the organic thin film layer is defined with a barrier groove on the peripheral region, the first pillow body is provided with a part covered by the organic thin film layer and the other part exposed by the barrier groove; the conductive layer is provided with a signal wire passing across an edge of the barrier groove, and an edge of the signal wire at least partially overlaps with the first pillow body.