公开(公告)号：US20240258337A1

公开(公告)日：2024-08-01

申请号：US18016471

申请日：2022-03-31

Applicant: BEIJING BOE TECHNOLOGY GROUP CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jinchao BAI ,  Bo LIU ,  Xiangqian DING ,  Hui GUO ,  Yihe JIA ,  Yanxin JI ,  Yue LIU

IPC: H01L27/12 ,  G02F1/1362

CPC classification number: H01L27/1244 ,  G02F1/136295 ,  H01L27/1259

Abstract: An array substrate includes a base substrate, a driving circuit layer with a first pillow body on a peripheral region of the array substrate, an organic thin film layer and a conductive layer sequentially stacked; the first pillow body includes a first pillow metal block located on at least one of a source drain metal layer and a gate layer and a first pillow insulating layer covering the first pillow metal block; the organic thin film layer is defined with a barrier groove on the peripheral region, the first pillow body is provided with a part covered by the organic thin film layer and the other part exposed by the barrier groove; the conductive layer is provided with a signal wire passing across an edge of the barrier groove, and an edge of the signal wire at least partially overlaps with the first pillow body.

公开(公告)号：US20160032155A1

公开(公告)日：2016-02-04

申请号：US14429186

申请日：2014-06-12

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ang XIAO

IPC: C09J133/14 ,  C08K5/544 ,  C08K3/36

CPC classification number: C09J133/14 ,  C08G59/34 ,  C08G59/4085 ,  C08K3/36 ,  C08K5/544 ,  C09J4/00 ,  C08F222/1006

Abstract: Disclosed are a sealant composition and a method of preparing the same wherein the sealant composition comprises: 70-80 wt % of a low-viscosity epoxy acrylate conforming to the structure of Formula I, 0.5-1 wt % of a photoinitiator, 5-15 wt % of silica microspheres, 5-15 wt % of resinous elastic microspheres, and 1-2 wt % of silane coupling agent, based on the total weight of the sealant composition wherein R1 and R2 are as defined herein. The sealant has improved coating linearity.

Abstract translation: 公开了一种密封剂组合物及其制备方法，其中密封剂组合物包含：70-80重量％的符合式I结构的低粘度环氧丙烯酸酯，0.5-1重量％的光引发剂，5-15重量％ 基于密封剂组合物的总重量，其中R 1和R 2如本文所定义，二氧化硅微球的重量％，5-15重量％的树脂弹性微球和1-2重量％的硅烷偶联剂。 密封剂具有改善的涂层线性度。