公开(公告)号：US20180305654A1

公开(公告)日：2018-10-25

申请号：US15769259

申请日：2016-10-17

Applicant: BEX CO., LTD.

Inventor： Yoko YAMANISHI ,  Takuya KAMBAYASHI ,  Kazuki TAKAHASHI

IPC: C12M1/42 ,  G03F7/038 ,  C12N15/89 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32

CPC classification number: C12M35/04 ,  C12M1/00 ,  C12N15/89 ,  G03F7/038 ,  G03F7/16 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2002 ,  G03F7/26 ,  G03F7/322

Abstract: A bubble-jetting chip capable of jetting bubbles upward from a substrate is provided.Bubbles can be jetted upward from a substrate by a bubble-jetting chip comprising: at least a substrate, an energizing portion, and a bubble-jetting portion; the energizing portion being formed on the substrate; the bubble-jetting portion comprising an electrode that is formed of a conductive material, a shell part formed of an insulating photosensitive resin, and an extended section that extends from the shell part, the shell part covering a periphery of the electrode, the extended section extending beyond a tip of the electrode, and the bubble-jetting portion further comprising a space formed between the extended section and the electrode; and the electrode of the bubble-jetting portion being formed on the energizing portion.